Inventor
KAWAI AKIHITO
JP14 patents
⚠️ This page may combine multiple inventors who share the name “KAWAI AKIHITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
13 patentsUS7129150B2Oct 31, 2006
Method of dividing a semiconductor wafer
DISCO CORP139 citations95
US11164802B2Nov 2, 2021
Wafer manufacturing method and multilayer device chip manufacturing method
DISCO CORP2 citations72
US12383982B2Aug 12, 2025
Laminated device wafer forming method
DISCO CORP1 citations61
US7687375B2Mar 30, 2010
Lamination device manufacturing method
DISCO CORP3 citations61
US10658220B2May 19, 2020
Device transferring method
DISCO CORP1 citations60
US12300545B2May 13, 2025
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US12198990B2Jan 14, 2025
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US11854891B2Dec 26, 2023
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US11764115B2Sep 19, 2023
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US11764114B2Sep 19, 2023
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US11756831B2Sep 12, 2023
Wafer manufacturing method and laminated device chip manufacturing method
DISCO CORP0 citations50
US12322655B2Jun 3, 2025
Method of manufacturing layered device chip assembly
DISCO CORP0 citations49
US7601485B2Oct 13, 2009
Exposure method
DISCO CORP0 citations41