Inventor
BUCHWALTER LEENA PAIVIKKI
US13 patents
⚠️ This page may combine multiple inventors who share the name “BUCHWALTER LEENA PAIVIKKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
9 patentsUS7276787B2Oct 2, 2007
Silicon chip carrier with conductive through-vias and method for fabricating same
IBM124 citations96
US7019402B2Mar 28, 2006
Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor
IBM23 citations92
US7943412B2May 17, 2011
Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters
IBM24 citations91
US7452568B2Nov 18, 2008
Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
IBM15 citations82
US7456046B2Nov 25, 2008
Method to create flexible connections for integrated circuits
IBM8 citations73
US7282391B1Oct 16, 2007
Method for precision assembly of integrated circuit chip packages
IBM5 citations62
US7815968B2Oct 19, 2010
Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation
IBM2 citations59
US7615405B2Nov 10, 2009
Method for precision assembly of integrated circuit chip packages
IBM0 citations52
US7932169B2Apr 26, 2011
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
IBM1 citations51