Inventor

CASEY JON

US2 patents

Patents

2 patents

US7452568B2Nov 18, 2008

Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation

IBM15 citations82

US7815968B2Oct 19, 2010

Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation

IBM2 citations59