Inventor
KANG SUNG K
US28 patents
⚠️ This page may combine multiple inventors who share the name “KANG SUNG K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
22 patentsUS5134460AJul 28, 1992
Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding
IBM265 citations99
US5185073AFeb 9, 1993
Method of fabricating nendritic materials
IBM173 citations98
US5137461AAug 11, 1992
Separable electrical connection technology
IBM134 citations97
US6805974B2Oct 19, 2004
Lead-free tin-silver-copper alloy solder composition
IBM59 citations94
US7410833B2Aug 12, 2008
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
IBM14 citations92
US7079393B2Jul 18, 2006
Fluidic cooling systems and methods for electronic components
IBM44 citations92
US5296189AMar 22, 1994
Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith
IBM39 citations92
US5135155AAug 4, 1992
Thermocompression bonding in integrated circuit packaging
IBM34 citations92
US5006917AApr 9, 1991
Thermocompression bonding in integrated circuit packaging
IBM25 citations92
US7523852B2Apr 28, 2009
Solder interconnect structure and method using injection molded solder
IBM11 citations84
US7452568B2Nov 18, 2008
Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
IBM15 citations82
US5242569ASep 7, 1993
Thermocompression bonding in integrated circuit packaging
IBM12 citations73
US5633047AMay 27, 1997
Electronic devices having metallurgies containing copper-semiconductor compounds
IBM15 citations72
US8026613B2Sep 27, 2011
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
IBM4 citations62
US7923849B2Apr 12, 2011
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
IBM3 citations62
US5148261ASep 15, 1992
Thermocompression bonding in integrated circuit packaging
IBM5 citations62
US5120418AJun 9, 1992
Lead frame plating apparatus for thermocompression bonding
IBM3 citations62
US7815968B2Oct 19, 2010
Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation
IBM2 citations59
US9872394B2Jan 16, 2018
Substrate via filling
IBM0 citations52
US9433101B2Aug 30, 2016
Substrate via filling
IBM0 citations52
US7784669B2Aug 31, 2010
Method and process for reducing undercooling in a lead-free tin-rich solder alloy
IBM1 citations49
US7703661B2Apr 27, 2010
Method and process for reducing undercooling in a lead-free tin-rich solder alloy
IBM1 citations49