Inventor
MORITA ETSUROU
JP13 patents
⚠️ This page may combine multiple inventors who share the name “MORITA ETSUROU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMCO CORP
11 patentsUS7354844B2Apr 8, 2008
Method for manufacturing SOI substrate
SUMCO CORP43 citations95
US7781309B2Aug 24, 2010
Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method
SUMCO CORP30 citations90
US7364984B2Apr 29, 2008
Method for manufacturing SOI substrate
SUMCO CORP12 citations83
US7736998B2Jun 15, 2010
Silicon-on insulator substrate and method for manufacturing the same
SUMCO CORP11 citations79
US7416960B2Aug 26, 2008
Method for manufacturing SOI substrate
SUMCO CORP7 citations73
US7960225B1Jun 14, 2011
Method of controlling film thinning of semiconductor wafer for solid-state image sensing device
SUMCO CORP4 citations61
US7855129B2Dec 21, 2010
Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method
SUMCO CORP5 citations60
US7718507B2May 18, 2010
Bonded wafer and method of producing the same
SUMCO CORP4 citations57
US7829436B2Nov 9, 2010
Process for regeneration of a layer transferred wafer and regenerated layer transferred wafer
SUMCO CORP1 citations49
US8048769B2Nov 1, 2011
Method for producing bonded wafer
SUMCO CORP0 citations41
US7951716B2May 31, 2011
Wafer and method of producing the same
SUMCO CORP0 citations36