Inventor
OKAWA SHINJI
JP5 patents
⚠️ This page may combine multiple inventors who share the name “OKAWA SHINJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMCO CORP
3 patentsUS7781309B2Aug 24, 2010
Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method
SUMCO CORP30 citations90
US7855129B2Dec 21, 2010
Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method
SUMCO CORP5 citations60
US7829436B2Nov 9, 2010
Process for regeneration of a layer transferred wafer and regenerated layer transferred wafer
SUMCO CORP1 citations49