Inventor
KITADA HIDEKI
JP31 patents
⚠️ This page may combine multiple inventors who share the name “KITADA HIDEKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
14 patentsUS6242808B1Jun 5, 2001
Semiconductor device with copper wiring and semiconductor device manufacturing method
FUJITSU LTD87 citations98
US7670925B2Mar 2, 2010
Semiconductor device, method of manufacturing same, and apparatus for designing same
FUJITSU LTD15 citations92
US7413977B2Aug 19, 2008
Method of manufacturing semiconductor device suitable for forming wiring using damascene method
FUJITSU LTD17 citations92
US7416985B2Aug 26, 2008
Semiconductor device having a multilayer interconnection structure and fabrication method thereof
FUJITSU LTD29 citations90
US7868456B2Jan 11, 2011
Semiconductor device and method for fabricating the same
FUJITSU LTD11 citations84
US7846833B2Dec 7, 2010
Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device
FUJITSU LTD7 citations74
US7713869B2May 11, 2010
Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device
FUJITSU LTD5 citations63
US7329952B2Feb 12, 2008
Method of fabricating a semiconductor device
FUJITSU LTD3 citations63
US7279790B2Oct 9, 2007
Semiconductor device and a manufacturing method thereof
FUJITSU LTD4 citations63
US11195577B2Dec 7, 2021
Switch element and method for manufacturing switch element
FUJITSU LTD0 citations62
US7205667B2Apr 17, 2007
Semiconductor device having copper wiring
FUJITSU LTD3 citations60
US10383229B2Aug 13, 2019
Electronic apparatus, fabrication method therefor and electronic part
FUJITSU LTD0 citations52
US10319667B2Jun 11, 2019
Electronic device and method of fabricating the same
FUJITSU LTD0 citations51
US10008436B2Jun 26, 2018
Semiconductor device
FUJITSU LTD0 citations51
SUMITOMO ELECTRIC INDUSTRIES
6 patentsUS6257561B1Jul 10, 2001
Air spring
SUMITOMO ELECTRIC INDUSTRIES46 citations92
US10563719B2Feb 18, 2020
Air spring and bogie
SUMITOMO ELECTRIC INDUSTRIES1 citations61
US10449979B2Oct 22, 2019
Air spring and bogie
SUMITOMO ELECTRIC INDUSTRIES1 citations61
US10435044B2Oct 8, 2019
Air spring and bogie
SUMITOMO ELECTRIC INDUSTRIES1 citations61
US10597050B2Mar 24, 2020
Air spring and bogie
SUMITOMO ELECTRIC INDUSTRIES0 citations40
US10538257B2Jan 21, 2020
Air spring and bogie
SUMITOMO ELECTRIC INDUSTRIES0 citations39
KITADA HIDEKI
3 patentsUS8319277B2Nov 27, 2012
Semiconductor device, method of manufacturing same, and apparatus for designing same
KITADA HIDEKI15 citations91
US9202752B2Dec 1, 2015
Semiconductor device with first and second semiconductor substrates
KITADA HIDEKI2 citations61
US8836122B2Sep 16, 2014
Semiconductor device having copper wiring with increased migration resistance
KITADA HIDEKI0 citations40
FUJITSU SEMICONDUCTOR LTD
3 patentsUS7795141B2Sep 14, 2010
Method of manufacturing semiconductor device suitable for forming wiring using damascene method
FUJITSU SEMICONDUCTOR LTD5 citations74
US8383509B2Feb 26, 2013
Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloy and semiconductor device of this kind
FUJITSU SEMICONDUCTOR LTD0 citations49
US7871924B2Jan 18, 2011
Semiconductor device having copper wiring
FUJITSU SEMICONDUCTOR LTD1 citations49
FUJITSU MICROELECTRONICS LTD
2 patentsUS7507666B2Mar 24, 2009
Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition
FUJITSU MICROELECTRONICS LTD49 citations92
US7611984B2Nov 3, 2009
Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloy
FUJITSU MICROELECTRONICS LTD17 citations90