Inventor

HSU SHIH-PING

TW168 patents

⚠️ This page may combine multiple inventors who share the name “HSU SHIH-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSU SHIH-PING

PHOENIX PREC TECHNOLOGY CORP

Stack structure with semiconductor chip embedded in carrier

Circuit board structure with embedded electronic components

Semiconductor package substrate with embedded chip and fabrication method thereof

Module structure having embedded chips

Heat sink structure with embedded electronic components for semiconductor package

Method of embedding semiconductor chip in support plate

Method of embedding semiconductor chip in support plate and embedded structure thereof

Method for fabricating thermally enhanced semiconductor device

Substrate assembly with direct electrical connection as a semiconductor package

Substrate structure for semiconductor package and manufacturing method thereof

Coreless package substrate with conductive structures

Semiconductor package substrate having contact pad protective layer formed thereon

Substrate for pre-soldering material and fabrication method thereof

Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same

Method for fabricating substrate within a Ni/Au structure electroplated on electrical contact pads

Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier

Package substrate and method for fabricating the same

Package structure having semiconductor chip embedded therein and method for fabricating the same

Stack structure of circuit boards embedded with semiconductor chips

Stack structure of circuit board with semiconductor component embedded therein

Surface roughening method for embedded semiconductor chip structure

Multi-layer circuit board with fine pitches and fabricating method thereof

Package structure with circuits directly connected to semiconductor chip

Chip embedded packaging structure

Circuit board with optoelectronic component embedded therein

Semiconductor chip electrical connection structure

Circuit board structure of integrated optoelectronic component

Method for fabricating a flip chip package

Surface structure of flip chip substrate

Semiconductor device integrated with optoelectronic components

Circuit board structure with embedded selectable passive components and method for fabricating the same

Circuit board structure with embedded semiconductor chip and method for fabricating the same

Method for fabricating connection terminal of circuit board

Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same

Circuit board with identifiable information and method for fabricating the same

UNIMICRON TECHNOLOGY CORP

Circuit board structure having embedded semiconductor element and fabrication method thereof

Circuit board structure having electronic components integrated therein

Structure of circuit board and method for fabricating same

Method of fabricating a package structure

Embedded chip package structure with chip support protruding section

Fabrication method of package structure having embedded semiconductor component

Method for fabricating a flip chip substrate structure

HSU SHIH-PING

Circuit board structure and fabrication method thereof

Coreless packaging substrate and method for fabricating the same

Substrate structure with capacitor component embedded therein and method for fabricating the same

Packaging substrate with conductive structure

Method of fabricating a packaging structure

Packaging substrate having a passive element embedded therein and method of fabricating the same

PHOENIX PREC TECHNOLOGY CORPRO

Substrate structure with embedded semiconductor chip and fabrication method thereof

PHOENIX PREC TECHNOLOGY

Substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same