Inventor
ZAHR GEORGE ELIAS
US16 patents
⚠️ This page may combine multiple inventors who share the name “ZAHR GEORGE ELIAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DU PONT
7 patentsUS6890635B2May 10, 2005
Low loss dielectric material for printed circuit boards and integrated circuit chip packaging
DU PONT43 citations92
US7658988B2Feb 9, 2010
Printed circuits prepared from filled epoxy compositions
DU PONT25 citations91
US7829188B2Nov 9, 2010
Filled epoxy compositions
DU PONT17 citations83
US6277948B1Aug 21, 2001
Process and product for making polyamides
DU PONT18 citations83
US6274697B1Aug 14, 2001
Process and product for making polyamides
DU PONT10 citations73
US7265182B2Sep 4, 2007
Polyamic acid cross-linked polymer and formable composition therefrom
DU PONT5 citations62
US7265181B2Sep 4, 2007
Polyimide cross-linked polymer and shaped article thereof
DU PONT4 citations62
ZAHR GEORGE ELIAS
5 patentsUS8663804B2Mar 4, 2014
Printed wiring board encapsulated by adhesive laminate comprising a di-isoimide, and process for preparing same
ZAHR GEORGE ELIAS2 citations60
US8415470B2Apr 9, 2013
Di-isoimide composition
ZAHR GEORGE ELIAS2 citations60
US8586734B2Nov 19, 2013
Process for preparing substituted and unsubstituted diamino triazine aromatic di-isoimides
ZAHR GEORGE ELIAS0 citations50
US8580386B2Nov 12, 2013
Laminate comprising curable epoxy film layer comprising a di-isoimide and process for preparing same
ZAHR GEORGE ELIAS1 citations50
US8536170B2Sep 17, 2013
Curable composition comprising a di-isoimide, method of curing, and the cured composition so formed
ZAHR GEORGE ELIAS0 citations50
LIN PUI-YAN
4 patentsUS8288466B2Oct 16, 2012
Composite of a polymer and surface modified hexagonal boron nitride particles
LIN PUI-YAN10 citations82
US8784980B2Jul 22, 2014
Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles
LIN PUI-YAN5 citations71
US8484839B2Jul 16, 2013
Multi-layer chip carrier and process for making
LIN PUI-YAN2 citations60
US8163381B2Apr 24, 2012
Multi-layer chip carrier and process for making
LIN PUI-YAN2 citations60