Inventor
HWANG MI SUN
KR26 patents
⚠️ This page may combine multiple inventors who share the name “HWANG MI SUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
21 patentsUS9899136B2Feb 20, 2018
Coil component and method of manufacturing the same
SAMSUNG ELECTRO MECH11 citations82
US9832866B2Nov 28, 2017
Multilayered substrate and method of manufacturing the same
SAMSUNG ELECTRO MECH7 citations82
US11183462B2Nov 23, 2021
Substrate having electronic component embedded therein
SAMSUNG ELECTRO MECH2 citations69
US10304628B2May 28, 2019
Multilayer capacitor and manufacturing method thereof
SAMSUNG ELECTRO MECH1 citations62
US11013114B2May 18, 2021
Printed circuit board
SAMSUNG ELECTRO MECH0 citations61
US10887986B2Jan 5, 2021
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations61
US11744012B2Aug 29, 2023
Printed circuit board and substrate including electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations60
US11631643B2Apr 18, 2023
Substrate embedded electronic component package
SAMSUNG ELECTRO MECH0 citations60
US10650958B2May 12, 2020
Coil electronic component
SAMSUNG ELECTRO MECH1 citations60
US11076487B2Jul 27, 2021
Electronic component embedded substrate
SAMSUNG ELECTRO MECH1 citations58
US10849226B2Nov 24, 2020
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations58
US10779409B2Sep 15, 2020
Printed circuit board
SAMSUNG ELECTRO MECH1 citations58
US11528804B2Dec 13, 2022
Printed circuit board
SAMSUNG ELECTRO MECH0 citations56
US11910527B2Feb 20, 2024
Substrate with electronic component embedded therein
SAMSUNG ELECTRO MECH1 citations53
US8720048B2May 13, 2014
Method of manufacturing a printed circuit board
SAMSUNG ELECTRO MECH0 citations52
US11763982B2Sep 19, 2023
Inductor and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations50
US9706644B2Jul 11, 2017
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations49
US11640952B2May 2, 2023
Electronic component embedded substrate
SAMSUNG ELECTRO MECH0 citations48
US11017930B2May 25, 2021
Inductor
SAMSUNG ELECTRO MECH0 citations47
US12389546B2Aug 12, 2025
Printed circuit board, electronic component-embedded substrate, and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations46
US10455708B2Oct 22, 2019
Multilayered substrate and method for manufacturing the same
SAMSUNG ELECTRO MECH0 citations40