Inventor

KOLICS ARTUR

US60 patents

⚠️ This page may combine multiple inventors who share the name “KOLICS ARTUR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOLICS ARTUR

LAM RES CORP

Vacuum-integrated hardmask processes and apparatus

Vacuum-integrated hardmask processes and apparatus

Vacuum-integrated hardmask processes and apparatus

Vacuum-integrated hardmask processes and apparatus

Atomic layer etching for enhanced bottom-up feature fill

Interlevel conductor pre-fill utilizing selective barrier deposition

Interlevel conductor pre-fill utilizing selective barrier deposition

Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etch

Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor

Method for strengthening adhesion between dielectric layers formed adjacent to metal layers

Metallization of the wafer edge for optimized electroplating performance on resistive substrates

Interlevel conductor pre-fill utilizing selective barrier deposition

Dual damascene fill

Method of making an interconnect device

Methods and materials for anchoring gapfill metals

Devices for metallization

Adhesion layer for through silicon via metallization

Method for strengthening adhesion between dielectric layers formed adjacent to metal layers

Porous dielectrics K value restoration by thermal treatment and or solvent treatment

Copper interconnect

Metallization of the wafer edge for optimized electroplating performance on resistive substrates

Wafer cleaning formulation

Metallization of the wafer edge for optimized electroplating performance on resistive substrates

Two-step deposition with improved selectivity

Metallization mixtures and electronic devices

Post-deposition cleaning methods for substrates with cap layers

Electroless deposition chemical system limiting strongly adsorbed species

Methods for wet metal seed deposition for bottom up gapfill of features

KOLICS ARTUR

Post-deposition cleaning methods and formulations for substrates with cap layers

Methods and layers for metallization

Cleaning solution formulations for substrates

Post deposition wafer cleaning formulation

Processes and solutions for substrate cleaning and electroless deposition

Solutions and methods for metal deposition

Electroless deposition solutions and process control

Methods and materials for anchoring gapfill metals

Metallization processes, mixtures, and electronic devices

Methods, devices, and materials for metallization

BLUE29 LLC

Apparatus and method for electroless deposition of materials on semiconductor substrates

Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper

Solution composition and method for electroless deposition of coatings free of alkali metals

Temperature-controlled substrate holder for processing in fluids

Method and apparatus for electroless deposition with temperature-controlled chuck

Spatially-arranged chemical processing station

IVANOV IGOR C

Apparatus and method for electroless deposition of materials on semiconductor substrates

Method for strengthening adhesion between dielectric layers formed adjacent to metal layers

Apparatus and method for electroless deposition of materials on semiconductor substrates

BLUE29 CORP

Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation

KLA TENCOR TECH CORP

Nano-electrode-array for integrated circuit interconnects

MATTSON TECH INC

Temperature control sequence of electroless plating baths