Inventor

DOAN TRUNG TRI

US206 patents

⚠️ This page may combine multiple inventors who share the name “DOAN TRUNG TRI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DOAN TRUNG TRI

MICRON TECHNOLOGY INC

Wafer level semiconductor component having thinned, encapsulated dice and polymer dam

Method for fabricating encapsulated semiconductor components having conductive vias

Method of fabricating encapsulated semiconductor components by etching

Method for fabricating encapsulated semiconductor components

Semiconductor component having backside pin contacts

Semiconductor component with backside contacts and method of fabrication

Method of forming capacitor constructions

Methods of treating dielectric materials with oxygen, and methods of forming capacitor constructions

System for real-time control of semiconductor wafer polishing

Method of forming trench isolation regions

System for real-time control of semiconductor wafer polishing

Method and apparatus for selectively conditioning a polished pad used in planarizng substrates

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing including heater

Polishing pad with elongated microcolumns

Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers

System for real-time control of semiconductor wafer polishing including heater

System for real-time control of semiconductor wafer polishing including optical montoring

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing including optical monitoring

System for real-time control of semiconductor wafer polishing including heater

System having semiconductor component with multiple stacked dice

Semiconductor component having multiple stacked dice

Method of forming a Ta2O5 comprising layer

Method for making polishing pad with elongated microcolumns

Apparatus and method for planar end-point detection during chemical-mechanical polishing

System for real-time control of semiconductor wafer polishing

Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts

Semiconductor components having stacked dice

Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts

Method for fabricating encapsulated semiconductor components

Semiconductor component and assembly having female conductive members

Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts

Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts

Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine

Method of making vertical diode structures

Methods of forming capacitor constructions

Method of forming trench isolation regions

Methods of forming capacitor constructions

Methods of forming trench isolation regions

Semiconductor processing methods of removing conductive material

Methods of treating surfaces of substrates

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

SEMILEDS CORP

Light emitting diode with conducting metal substrate

Systems and methods for producing white-light light emitting diodes

Systems and methods for producing white-light emitting diodes

Light emitting diodes (LEDs) with improved light extraction by roughening

Method of making a light emitting diode

SEMILEDS OPTOELECTRONICS CO LT

Epitaxial structure for metal devices