Inventor
KAO YI-FAN
TW5 patents
Patents
5 patentsUS9831167B1Nov 28, 2017
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
KINSUS INTERCONNECT TECH CORP7 citations82
US9301405B1Mar 29, 2016
Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole
KINSUS INTERCONNECT TECH CORP10 citations81
US9439292B1Sep 6, 2016
Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure
KINSUS INTERCONNECT TECH CORP9 citations80
US9406641B2Aug 2, 2016
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
KINSUS INTERCONNECT TECH CORP3 citations71
US9754870B2Sep 5, 2017
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
KINSUS INTERCONNECT TECH CORP0 citations50