Inventor
CHANG SHUO-HSUN
TW10 patents
⚠️ This page may combine multiple inventors who share the name “CHANG SHUO-HSUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KINSUS INTERCONNECT TECH CORP
7 patentsUS9831167B1Nov 28, 2017
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
KINSUS INTERCONNECT TECH CORP7 citations82
US9406641B2Aug 2, 2016
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
KINSUS INTERCONNECT TECH CORP3 citations71
US11044806B2Jun 22, 2021
Method for manufacturing multi-layer circuit board capable of being applied with electrical testing
KINSUS INTERCONNECT TECH CORP0 citations57
US10334719B2Jun 25, 2019
Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same
KINSUS INTERCONNECT TECH CORP1 citations57
US9754870B2Sep 5, 2017
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
KINSUS INTERCONNECT TECH CORP0 citations50
US10548214B2Jan 28, 2020
Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same
KINSUS INTERCONNECT TECH CORP0 citations47
US10455694B2Oct 22, 2019
Method for manufacturing a multi-layer circuit board capable of being applied with electrical testing
KINSUS INTERCONNECT TECH CORP0 citations47