P

Inventor

OKA OSAMU

JP44 patents
⚠️ This page may combine multiple inventors who share the name “OKA OSAMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOMOEGAWA PAPER CO LTD

29 patents
US6187874B1Feb 13, 2001

Adhesive for electronic parts and adhesive tape for electronic parts

TOMOEGAWA PAPER CO LTD22 citations92
US6132865AOct 17, 2000

Adhesive tape for electronic parts

TOMOEGAWA PAPER CO LTD16 citations90
US5821309AOct 13, 1998

Polyaniline derivatives and their production process

TOMOEGAWA PAPER CO LTD16 citations82
US5851616ADec 22, 1998

Adhesive tape for electronic parts and liquid adhesive

TOMOEGAWA PAPER CO LTD16 citations81
US6268033B1Jul 31, 2001

Heat-resisting adhesive composition and adhesive tapes for electronic parts

TOMOEGAWA PAPER CO LTD8 citations74
US5635563AJun 3, 1997

Polyaniline derivatives and their production process

TOMOEGAWA PAPER CO LTD7 citations74
US5574131ANov 12, 1996

Polyaniline derivatives and their production process

TOMOEGAWA PAPER CO LTD7 citations74
US5304613AApr 19, 1994

Polyaniline derivative containing at least a 2-butenylene structure

TOMOEGAWA PAPER CO LTD6 citations74
US5250639AOct 5, 1993

Polyaniline derivatives and their production process

TOMOEGAWA PAPER CO LTD11 citations74
US5237023AAug 17, 1993

Polyaniline derivatives and their production process

TOMOEGAWA PAPER CO LTD19 citations74
US5100977AMar 31, 1992

Production process of polyaniline derivatives

TOMOEGAWA PAPER CO LTD8 citations74
US6265042B1Jul 24, 2001

Adhesive tape for electronic parts

TOMOEGAWA PAPER CO LTD8 citations73
US6045886AApr 4, 2000

Adhesive tape for electronic parts

TOMOEGAWA PAPER CO LTD7 citations73
US5959068ASep 28, 1999

Adhesive tape for electronic parts and liquid adhesive

TOMOEGAWA PAPER CO LTD6 citations73
US5866250AFeb 2, 1999

Adhesive tape for electronic parts and liquid adhesive

TOMOEGAWA PAPER CO LTD13 citations73
US5725948AMar 10, 1998

Adhesive tape for electronic parts and liquid adhesive

TOMOEGAWA PAPER CO LTD12 citations73
US5723571AMar 3, 1998

Polyimide and process for producing the same

TOMOEGAWA PAPER CO LTD8 citations73
US5336374AAug 9, 1994

Composite comprising paper and electro-conducting polymers and its production process

TOMOEGAWA PAPER CO LTD5 citations73
US6395391B1May 28, 2002

Adhesive tape for electronic parts

TOMOEGAWA PAPER CO LTD13 citations71
US6228452B1May 8, 2001

Adhesive tape for electronic parts

TOMOEGAWA PAPER CO LTD9 citations71
US6770370B2Aug 3, 2004

Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same

TOMOEGAWA PAPER CO LTD10 citations69
US5891540AApr 6, 1999

Adhesive tape for electronic parts

TOMOEGAWA PAPER CO LTD3 citations63
US5696235ADec 9, 1997

Polyimide AMD process for producing the same

TOMOEGAWA PAPER CO LTD6 citations63
US5623020AApr 22, 1997

Polyaniline derivatives and their production process

TOMOEGAWA PAPER CO LTD3 citations63
US5621053AApr 15, 1997

Polyaniline derivatives and their production process

TOMOEGAWA PAPER CO LTD4 citations63
US5254670AOct 19, 1993

Polyaniline derivatives and their production process

TOMOEGAWA PAPER CO LTD4 citations63
US6329050B1Dec 11, 2001

Adhesive for electronic parts and adhesive tape for electronic parts

TOMOEGAWA PAPER CO LTD3 citations62
US5663287ASep 2, 1997

Polyimide and process for producing the same

TOMOEGAWA PAPER CO LTD5 citations58
US6184337B1Feb 6, 2001

Adhesive tape for electronic parts and liquid adhesive

TOMOEGAWA PAPER CO LTD0 citations51

SONY CORP

4 patents

ORIENTAL YEAST CO LTD

4 patents

NISSHIN FLOUR MILLING CO

1 patent

ZAIDAN HOJIN SHOKUHIN SANGYO

1 patent

TOMEGAWA PAPER CO LTD

1 patent

TOMOEGAWA PAPER CO INC

1 patent

C/O SONY CORP

1 patent

SONY SEMICONDUCTOR SOLUTIONS CORP

1 patent

AGENCY IND SCIENCE TECHN

1 patent