Inventor
CHEN CHIA-YANG
TW28 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHIA-YANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
24 patentsUS10410970B1Sep 10, 2019
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD13 citations84
US11222852B2Jan 11, 2022
Method for fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations73
US10461041B2Oct 29, 2019
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations73
US9673151B2Jun 6, 2017
Semiconductor package having metal layer
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations71
US9508656B2Nov 29, 2016
Package structure and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations71
US10916526B2Feb 9, 2021
Method for fabricating electronic package with conductive pillars
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations70
US10199317B2Feb 5, 2019
Electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations68
US11723144B2Aug 8, 2023
Electronic device and circuit board thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US11069633B2Jul 20, 2021
Electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US12057409B2Aug 6, 2024
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations60
US12100641B2Sep 24, 2024
Electronic package and method for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US11749583B2Sep 5, 2023
Electronic package and method for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US10643974B2May 5, 2020
Electronic package with conductive pillars
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations59
US12211776B2Jan 28, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations58
US11764162B2Sep 19, 2023
Electronic package and method for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US10074613B2Sep 11, 2018
Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US8962396B2Feb 24, 2015
Fabrication method of carrier-free semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US10074621B2Sep 11, 2018
Electronic package with antenna structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US9899335B2Feb 20, 2018
Method for fabricating package structure
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations50
US12500181B2Dec 16, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9490219B2Nov 8, 2016
Semiconductor package with shielding member and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9343401B2May 17, 2016
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9999132B2Jun 12, 2018
Electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48
US9502377B2Nov 22, 2016
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40