Inventor
MCCORMICK JOHN
US40 patents
⚠️ This page may combine multiple inventors who share the name “MCCORMICK JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
12 patentsUS5801432ASep 1, 1998
Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes
LSI LOGIC CORP139 citations96
US5763952AJun 9, 1998
Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
LSI LOGIC CORP43 citations96
US5681777AOct 28, 1997
Process for manufacturing a multi-layer tab tape semiconductor device
LSI LOGIC CORP39 citations96
US5639385AJun 17, 1997
Method of fabricating a wafer probe card for testing an integrated circuit die
LSI LOGIC CORP37 citations96
US5638596AJun 17, 1997
Method of employing multi-layer tab tape in semiconductor device assembly by selecting, breaking, downwardly bending and bonding tab tape trace free ends to a ground or power plane
LSI LOGIC CORP42 citations96
US5552631ASep 3, 1996
Semiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor die
LSI LOGIC CORP67 citations96
US5550406AAug 27, 1996
Multi-layer tab tape having distinct signal, power and ground planes and wafer probe card with multi-layer substrate
LSI LOGIC CORP58 citations96
US5898575AApr 27, 1999
Support assembly for mounting an integrated circuit package on a surface
LSI LOGIC CORP51 citations95
US5410451AApr 25, 1995
Location and standoff pins for chip on tape
LSI LOGIC CORP67 citations95
US6171888B1Jan 9, 2001
Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
LSI LOGIC CORP31 citations92
US6008991ADec 28, 1999
Electronic system including packaged integrated circuits with heat spreading standoff support members
LSI LOGIC CORP34 citations92
US5854085ADec 29, 1998
Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
LSI LOGIC CORP24 citations90
CHANNEL ONE HOLDINGS INC
4 patentsUS11221932B2Jan 11, 2022
Methods and systems for monitoring the integrity of a GPU
CHANNEL ONE HOLDINGS INC1 citations69
US10776235B2Sep 15, 2020
Methods and systems for monitoring the integrity of a GPU
CHANNEL ONE HOLDINGS INC1 citations69
US10540738B2Jan 21, 2020
Methods and systems for monitoring the subset of GPU components used by an application in safety critical environments
CHANNEL ONE HOLDINGS INC0 citations47
US10354357B2Jul 16, 2019
Methods and systems for monitoring the subset of GPU components used by an application in safety critical environments
CHANNEL ONE HOLDINGS INC0 citations47