Inventor
HUANG I-HSIUNG
TW41 patents
⚠️ This page may combine multiple inventors who share the name “HUANG I-HSIUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
19 patentsUS6664028B2Dec 16, 2003
Method of forming opening in wafer layer
UNITED MICROELECTRONICS CORP24 citations92
US6589881B2Jul 8, 2003
Method of forming dual damascene structure
UNITED MICROELECTRONICS CORP23 citations92
US6458705B1Oct 1, 2002
Method for forming via-first dual damascene interconnect structure
UNITED MICROELECTRONICS CORP44 citations92
US6337269B1Jan 8, 2002
Method of fabricating a dual damascene structure
UNITED MICROELECTRONICS CORP22 citations92
US6080527AJun 27, 2000
Optical proximity correction of L and T shaped patterns on negative photoresist
UNITED MICROELECTRONICS CORP59 citations92
US6839126B2Jan 4, 2005
Photolithography process with multiple exposures
UNITED MICROELECTRONICS CORP13 citations82
US6391757B1May 21, 2002
Dual damascene process
UNITED MICROELECTRONICS CORP17 citations82
US7617475B2Nov 10, 2009
Method of manufacturing photomask and method of repairing optical proximity correction
UNITED MICROELECTRONICS CORP12 citations81
US6492097B1Dec 10, 2002
Process for increasing a line width window in a semiconductor process
UNITED MICROELECTRONICS CORP19 citations81
US6579790B1Jun 17, 2003
Dual damascene manufacturing process
UNITED MICROELECTRONICS CORP8 citations74
US6350681B1Feb 26, 2002
Method of forming dual damascene structure
UNITED MICROELECTRONICS CORP9 citations72
US6489085B2Dec 3, 2002
Thermal reflow photolithographic process
UNITED MICROELECTRONICS CORP10 citations71
US6444410B1Sep 3, 2002
Method of improving photoresist profile
UNITED MICROELECTRONICS CORP10 citations71
US6582858B2Jun 24, 2003
Alternating phase shifting mask
UNITED MICROELECTRONICS CORP8 citations70
US6680163B2Jan 20, 2004
Method of forming opening in wafer layer
UNITED MICROELECTRONICS CORP3 citations63
US6656667B2Dec 2, 2003
Multiple resist layer photolithographic process
UNITED MICROELECTRONICS CORP2 citations63
US6316340B1Nov 13, 2001
Photolithographic process for preventing corner rounding
UNITED MICROELECTRONICS CORP3 citations63
US6312855B1Nov 6, 2001
Three-phase phase shift mask
UNITED MICROELECTRONICS CORP4 citations62
US6380077B1Apr 30, 2002
Method of forming contact opening
UNITED MICROELECTRONICS CORP1 citations52
AU OPTRONICS CORP
4 patentsUS10416804B2Sep 17, 2019
Dual-mode capacitive touch display panel
AU OPTRONICS CORP2 citations70
US10996498B2May 4, 2021
Display apparatus with touch sensing and force sensing functions
AU OPTRONICS CORP1 citations59
US10712864B2Jul 14, 2020
Dual-mode capacitive touch display panel
AU OPTRONICS CORP0 citations49
US9025092B2May 5, 2015
Liquid crystal display comprising liquid crystal lens driven at a first time period and a second time period
AU OPTRONICS CORP0 citations37
TAIWAN SEMICONDUCTOR MFG CO LTD
4 patentsUS9196515B2Nov 24, 2015
Litho cluster and modulization to enhance productivity
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12276906B2Apr 15, 2025
Methods for cleaning lithography mask
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12429783B2Sep 30, 2025
EUV lithography apparatus and operating method for mitigating contamination
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US9601324B2Mar 21, 2017
Method of making wafer assembly
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
HUANG I-HSIUNG
4 patentsUS9111982B2Aug 18, 2015
Wafer assembly with carrier wafer
HUANG I-HSIUNG0 citations50
US8903532B2Dec 2, 2014
Litho cluster and modulization to enhance productivity
HUANG I-HSIUNG0 citations50
US8101530B2Jan 24, 2012
Lithography patterning method
HUANG I-HSIUNG1 citations50
US8609545B2Dec 17, 2013
Method to improve mask critical dimension uniformity (CDU)
HUANG I-HSIUNG0 citations35