Inventor
YOSHIHARA SHINJI
JP33 patents
⚠️ This page may combine multiple inventors who share the name “YOSHIHARA SHINJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
17 patentsUS6555901B1Apr 29, 2003
Semiconductor device including eutectic bonding portion and method for manufacturing the same
DENSO CORP380 citations98
US6429506B1Aug 6, 2002
Semiconductor device produced by dicing
DENSO CORP82 citations97
US6287885B1Sep 11, 2001
Method for manufacturing semiconductor dynamic quantity sensor
DENSO CORP84 citations97
US6255741B1Jul 3, 2001
Semiconductor device with a protective sheet to affix a semiconductor chip
DENSO CORP150 citations97
US6245593B1Jun 12, 2001
Semiconductor device with flat protective adhesive sheet and method of manufacturing the same
DENSO CORP99 citations97
US6450029B1Sep 17, 2002
Capacitive physical quantity detection device
DENSO CORP61 citations96
US6313529B1Nov 6, 2001
Bump bonding and sealing a semiconductor device with solder
DENSO CORP78 citations96
US6277756B1Aug 21, 2001
Method for manufacturing semiconductor device
DENSO CORP64 citations95
US6858451B2Feb 22, 2005
Method for manufacturing a dynamic quantity detection device
DENSO CORP13 citations84
US6747329B2Jun 8, 2004
Semiconductor sensor chip having diaphragm and method of manufacturing the same
DENSO CORP15 citations84
US6658948B2Dec 9, 2003
Semiconductor dynamic quantity sensor
DENSO CORP13 citations84
US7091109B2Aug 15, 2006
Semiconductor device and method for producing the same by dicing
DENSO CORP9 citations73
US6787929B2Sep 7, 2004
Semiconductor device having a flat protective adhesive sheet
DENSO CORP7 citations73
US6960487B2Nov 1, 2005
Method for manufacturing a dynamic quantity detection device
DENSO CORP2 citations63
US7174072B2Feb 6, 2007
Optical device having optical waveguide and method for manufacturing the same
DENSO CORP3 citations62
US6995466B2Feb 7, 2006
Semiconductor device having passivation cap and method for manufacturing the same
DENSO CORP1 citations52
US6938501B2Sep 6, 2005
Semiconductor dynamic quantity sensor
DENSO CORP0 citations42
KOBE STEEL LTD
6 patentsUS6059902AMay 9, 2000
Aluminum alloy of excellent machinability and manufacturing method thereof
KOBE STEEL LTD35 citations92
US9551054B2Jan 24, 2017
7xxx series aluminum alloy member excellent in stress corrosion cracking resistance and method for manufacturing the same
KOBE STEEL LTD1 citations50
US9206496B2Dec 8, 2015
Aluminum alloy extruded material for electro-magnetic forming
KOBE STEEL LTD1 citations50
US12252765B2Mar 18, 2025
Automotive door beam made of aluminum alloy extruded material
KOBE STEEL LTD0 citations44
US10487383B2Nov 26, 2019
Method for producing 7000-series aluminum alloy member excellent in stress corrosion cracking resistance
KOBE STEEL LTD0 citations40
US9657374B2May 23, 2017
Free-machining aluminum alloy extruded material with reduced surface roughness and excellent productivity
KOBE STEEL LTD0 citations37
NIPPON DENSO CO
3 patentsUS5824177AOct 20, 1998
Method for manufacturing a semiconductor device
NIPPON DENSO CO184 citations98
US5668033ASep 16, 1997
Method for manufacturing a semiconductor acceleration sensor device
NIPPON DENSO CO301 citations96
US4975390ADec 4, 1990
Method of fabricating a semiconductor pressure sensor
NIPPON DENSO CO125 citations96
NEC CORP
3 patentsUS5835778ANov 10, 1998
Preinitialized load module modifying system
NEC CORP55 citations92
US6421786B1Jul 16, 2002
Virtual system time management system utilizing a time storage area and time converting mechanism
NEC CORP6 citations63
US5684995ANov 4, 1997
Segment division management system
NEC CORP5 citations63