Inventor

ZHOU TINGDONG

US28 patents

⚠️ This page may combine multiple inventors who share the name “ZHOU TINGDONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHOU TINGDONG

IBM

3D chip testing through micro-C4 interface

Flow based package pin assignment

Reducing power grid noise in a processor while minimizing performance loss

Silicon interposer testing for three dimensional chip stack

Interconnect array pattern with a 3:1 signal-to-ground ratio

Distribution of power vias in a multi-layer circuit board

Interconnect array pattern with a 3:1 signal-to-ground ratio

3D chip testing through micro-C4 interface

Interconnect array pattern with a 3:1 signal-to-ground ratio

Electronic module power supply

3D chip testing through micro-C4 interface

Electronic module power supply

Electronic module power supply

Electronic module power supply

Distribution of power vias in a multi-layer circuit board

Reducing power grid noise in a processor while minimizing performance loss

System and method for power domain optimization

FREESCALE SEMICONDUCTOR INC

Package to board interconnect structure with built-in reference plane structure

Multiple interconnections between die

Package materials monitor and method therefor

BECKER WIREN DALE

Network flow based module bottom surface metal pin assignment

High-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost

Method for making high-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost

NXP USA INC

Device package substrate structure and method therefor

Device package substrate structure and method therefor

Substrate dielectric crack prevention using interleaved metal plane

CHRISTO MICHAEL A

Method of attaching an electronic module power supply

CABRERA DULCE M ALTABELLA

Reducing crosstalk in the design of module nets