Inventor

LEE CHIA-YEN

SG41 patents

⚠️ This page may combine multiple inventors who share the name “LEE CHIA-YEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE CHIA-YEN

DELTA ELECTRONICS INC

Semiconductor component having a lateral semiconductor device and a vertical semiconductor device

Embedded packaging device

Semiconductor device

Manufacturing method of packaging device

Packaging device and manufacturing method thereof

Embedded package structure and method for manufacturing thereof

Interconnection structure having a via structure

Method for predicting and compensating frictions of feed system, and computer readable storage

Power module package having patterned insulation metal substrate

Power module package having patterned insulation metal substrate

Method of forming interconnection structure of package structure

Interconnection structure of package structure and method of forming the same

Power module package having patterned insulation metal substrate

Wafer-level chip scale package

Electrically switchable light-modulating cell with via for image display apparatus

HON HAI PREC IND CO LTD

Display screen

Holder for mobile device and vehicle seat employing same

Tread depth measuring system

Vehicle seat

Charging gun for electric vehicle

Wireless charging device for vehicles

Supporting assembly for electronic device

System and method for projecting images of an electronic device on a vehicle window

Vehicle charging device

IND TECH RES INST

Resistive-type humidity sensing structure with microbridge and method therefor

Power module with housing having bending sections

Humidity sensing structure having a cantilever resistor and method for fabricating the same

FUDING PREC COMPONENTS SHENZHEN CO LTD

Vehicle control method and smart car key

Center information display system, vehicle, and method for adjusting view angle of center information display

INFINEON TECHNOLOGIES AG

Semiconductor package with leadframe interconnection structure

Semiconductor package with leadframe interconnection structure

LEE CHIA-YEN

Three-dimensional display device

Dual-spectrum heat pattern separation algorithm for assessing chemotherapy treatment response and early detection

LEXTAR ELECTRONICS CORP

Light emitting chip and light emitting device having the same

Light-emitting device

TAIWAN SEMICONDUCTOR MFG

Dummy wafers in 3DIC package assemblies

MIICS & PARTNERS SHENZHEN CO LTD

Wiper ring and charging pile using same

LIANG RONG-CHANG

Light modulating cell, device and system

CHEN CHUNG-MING

Longitudinal image registration algorithm for infrared images for chemotherapy response monitoring and early detection of breast cancers

UNIV NAT TAIWAN

Dual-spectrum heat pattern separation algorithm for assessing chemotherapy treatment response and early detection

FU LUNG-MING

Electromagnetic micro-pump