Inventor

TALIEH HOMAYOUN

US105 patents

⚠️ This page may combine multiple inventors who share the name “TALIEH HOMAYOUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TALIEH HOMAYOUN

NUTOOL INC

Method for electrochemically processing a workpiece

Device providing electrical contact to the surface of a semiconductor workpiece during metal plating

Method for forming an electrical contact with a semiconductor substrate

Pad designs and structures for a versatile materials processing apparatus

Method and apparatus for depositing and controlling the texture of a thin film

Method and apparatus for electrochemical mechanical deposition

Chip interconnect and packaging deposition methods and structures

Method and apparatus for plating and polishing a semiconductor substrate

Apparatus for forming an electrical contact with a semiconductor substrate

Method and apparatus for electro-chemical mechanical deposition

Method and system to provide electroplanarization of a workpiece with a conducting material layer

Workpeice proximity plating apparatus

Vertically configured chamber used for multiple processes

Reverse linear polisher with loadable housing

Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing

Method and apparatus employing pad designs and structures with improved fluid distribution

Method for electro chemical mechanical deposition

Semiconductor workpiece proximity plating methods and apparatus

Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate

Anode assembly for plating and planarizing a conductive layer

Reverse linear chemical mechanical polisher with loadable housing

Method and structure for thru-mask contact electrodeposition

Apparatus for plating and polishing a semiconductor workpiece

Advanced chemical mechanical polishing system with smart endpoint detection

Method and apparatus for simultaneously cleaning and annealing a workpiece

ASM NUTOOL INC

Fabrication of semiconductor interconnect structures

Chip interconnect and packaging deposition methods and structures

Method and structure to improve reliability of copper interconnects

Method and apparatus for electro-chemical mechanical deposition

Method and apparatus for forming an electrical contact with a semiconductor substrate

Method and apparatus for processing a substrate with minimal edge exclusion

Electroetching process and system

Method and apparatus for depositing and controlling the texture of a thin film

Advanced chemical mechanical polishing system with smart endpoint detection

Multi step electrodeposition process for reducing defects and minimizing film thickness

Apparatus of sealing wafer backside for full-face processing

APPLIED MATERIALS INC

Chemical mechanical polishing apparatus with improved slurry distribution

Substrate polishing apparatus

Substrate polishing apparatus

Chemical mechanical polishing with a small polishing pad

Chemical mechanical polishing with a small polishing pad

Chemical mechanical polishing apparatus using multiple polishing pads

Coater having a controllable pressurized process chamber for semiconductor processing

ONTRAK SYSTEMS INC

Wafer polishing machine with fluid bearings and drive systems

Polishing pad cluster for polishing a semiconductor wafer

Wafer polishing machine with fluid bearings

Linear polisher and method for semiconductor wafer planarization

NOVELLUS SYSTEMS INC

Method of making rolling electrical contact to wafer front surface

Device providing electrical contact to the surface of a semiconductor workpiece during processing

NU TOOL INC

Modified plating solution for plating and planarization and process utilizing same