Inventor

BONAM RAVI K

US20 patents

⚠️ This page may combine multiple inventors who share the name “BONAM RAVI K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BONAM RAVI K

IBM

Resist having tuned interface hardmask layer for EUV exposure

Semiconductor wafer having trenches with varied dimensions for multi-chip modules

Planar wafer level fan-out of multi-chip modules having different size chips

Multiple chip bridge connector

Electronic package structure with offset stacked chips and top and bottom side cooling lid

Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate

Micro-fluidic channels having various critical dimensions

Secure fingerprinting of a trusted photomask

Determination of optical roughness in EUV structures

Determination of optical roughness in EUV structures

Three-dimensional microelectronic package with embedded cooling channels

Three-dimensional microelectronic package with embedded cooling channels

Direct bonded heterogeneous integration silicon bridge

Mask process aware calibration using mask pattern fidelity inspections

Integrated photoemission sources and scalable photoemission structures

Integrated photoemission sources and scalable photoemission structures

Care area generation by detection optimized methodology

Resist having tuned interface hardmask layer for EUV exposure

Resist having tuned interface hardmask layer for EUV exposure

HARTLEY JOHN G

Methods for fabricating three-dimensional nano-scale structures and devices