Inventor
BOKISA GEORGE S
US13 patents
⚠️ This page may combine multiple inventors who share the name “BOKISA GEORGE S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ROHCO INC MCGEAN
7 patentsUS5554211ASep 10, 1996
Aqueous electroless plating solutions
ROHCO INC MCGEAN66 citations95
US6086779AJul 11, 2000
Copper etching compositions and method for etching copper
ROHCO INC MCGEAN71 citations94
US6063172AMay 16, 2000
Aqueous immersion plating bath and method for plating
ROHCO INC MCGEAN48 citations92
US5928790AJul 27, 1999
Multilayer circuit boards and processes of making the same
ROHCO INC MCGEAN26 citations92
US5698087ADec 16, 1997
Plating bath and method for electroplating tin and/or lead
ROHCO INC MCGEAN29 citations92
US4662999AMay 5, 1987
Plating bath and method for electroplating tin and/or lead
ROHCO INC MCGEAN50 citations91
US4885064ADec 5, 1989
Additive composition, plating bath and method for electroplating tin and/or lead
ROHCO INC MCGEAN35 citations89
ATOTECH DEUTSCHLAND GMBH
6 patentsUS6361823B1Mar 26, 2002
Process for whisker-free aqueous electroless tin plating
ATOTECH DEUTSCHLAND GMBH90 citations97
US6720499B2Apr 13, 2004
Tin whisker-free printed circuit board
ATOTECH DEUTSCHLAND GMBH54 citations95
US6506314B1Jan 14, 2003
Adhesion of polymeric materials to metal surfaces
ATOTECH DEUTSCHLAND GMBH99 citations94
US6284309B1Sep 4, 2001
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
ATOTECH DEUTSCHLAND GMBH54 citations94
US6602440B2Aug 5, 2003
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
ATOTECH DEUTSCHLAND GMBH32 citations91
US6579591B2Jun 17, 2003
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
ATOTECH DEUTSCHLAND GMBH6 citations72