Inventor
HO HSIN-YING
TW27 patents
⚠️ This page may combine multiple inventors who share the name “HO HSIN-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
18 patentsUS11892346B2Feb 6, 2024
Optical system and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations73
US11287312B2Mar 29, 2022
Optical system and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG3 citations73
US11257799B2Feb 22, 2022
Optical sensor module and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG3 citations72
US9911877B2Mar 6, 2018
Electronic device, package structure and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG5 citations72
US11276806B2Mar 15, 2022
Semiconductor device package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations71
US10436635B2Oct 8, 2019
Active optical component with passive optical component and encapsulant for an optical device and electrical device including the same
ADVANCED SEMICONDUCTOR ENG2 citations70
US12379243B2Aug 5, 2025
Optical system and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11892570B2Feb 6, 2024
Optical assembly that generates distinctive irradiance pattern of light
ADVANCED SEMICONDUCTOR ENG0 citations62
US11626441B2Apr 11, 2023
Optical module
ADVANCED SEMICONDUCTOR ENG0 citations62
US11588081B2Feb 21, 2023
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations62
US10910532B2Feb 2, 2021
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US10424566B2Sep 24, 2019
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations62
US10770624B2Sep 8, 2020
Semiconductor device package, optical package, and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations61
US11551963B2Jan 10, 2023
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations56
US10629787B2Apr 21, 2020
Lid and an optical device package having the same
ADVANCED SEMICONDUCTOR ENG0 citations52
US10069051B2Sep 4, 2018
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations51
US10686105B2Jun 16, 2020
Optical package device
ADVANCED SEMICONDUCTOR ENG0 citations50
US10862014B2Dec 8, 2020
Optical device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations41
TAIWAN SEMICONDUCTOR MFG CO LTD
7 patentsUS11679469B2Jun 20, 2023
Chemical mechanical planarization tool
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US12300508B2May 13, 2025
Chemical mechanical polishing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11373879B2Jun 28, 2022
Chemical mechanical polishing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12172263B2Dec 24, 2024
Chemical mechanical planarization tool
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11189727B2Nov 30, 2021
FinFET contacts and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US10777423B2Sep 15, 2020
Chemical mechanical polishing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US11217479B2Jan 4, 2022
Multiple metallization scheme
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50