Inventor
LIANTO PRAYUDI
SG19 patents
Patents
19 patentsUS10515927B2Dec 24, 2019
Methods and apparatus for semiconductor package processing
APPLIED MATERIALS INC2 citations72
US10002771B1Jun 19, 2018
Methods for chemical mechanical polishing (CMP) processing with ozone
APPLIED MATERIALS INC3 citations67
US11355358B2Jun 7, 2022
Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applications
APPLIED MATERIALS INC1 citations62
US10319601B2Jun 11, 2019
Slurry for polishing of integrated circuit packaging
APPLIED MATERIALS INC1 citations62
US12424446B2Sep 23, 2025
Silicon (Si) dry etch for die-to-wafer thinning
APPLIED MATERIALS INC0 citations58
US11309278B2Apr 19, 2022
Methods for bonding substrates
APPLIED MATERIALS INC1 citations57
US11421316B2Aug 23, 2022
Methods and apparatus for controlling warpage in wafer level packaging processes
APPLIED MATERIALS INC1 citations56
US12469683B2Nov 11, 2025
Water vapor plasma to enhance surface hydrophilicity
APPLIED MATERIALS INC0 citations55
US12138742B2Nov 12, 2024
Methods and apparatus for processing a substrate
APPLIED MATERIALS INC0 citations55
US12020992B2Jun 25, 2024
Methods and apparatus for processing a substrate
APPLIED MATERIALS INC0 citations55
US11342256B2May 24, 2022
Method of fine redistribution interconnect formation for advanced packaging applications
APPLIED MATERIALS INC0 citations52
US11901225B2Feb 13, 2024
Diffusion layers in metal interconnects
APPLIED MATERIALS INC0 citations51
US11289387B2Mar 29, 2022
Methods and apparatus for backside via reveal processing
APPLIED MATERIALS INC0 citations51
US10636696B1Apr 28, 2020
Methods for forming vias in polymer layers
APPLIED MATERIALS INC0 citations51
US11899376B1Feb 13, 2024
Methods for forming alignment marks
APPLIED MATERIALS INC0 citations50
US11931855B2Mar 19, 2024
Planarization methods for packaging substrates
APPLIED MATERIALS INC0 citations48
US12588533B2Mar 24, 2026
Grain structure engineering for metal gapfill materials
APPLIED MATERIALS INC0 citations47
US9922874B2Mar 20, 2018
Methods of enhancing polymer adhesion to copper
APPLIED MATERIALS INC0 citations39
US12518367B2Jan 6, 2026
Defect classification of processed wafers
APPLIED MATERIALS INC0 citations35