Inventor

SEE GUAN HUEI

SG50 patents

⚠️ This page may combine multiple inventors who share the name “SEE GUAN HUEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEE GUAN HUEI

APPLIED MATERIALS INC

Method of redistribution layer formation for advanced packaging applications

Method of reconstituted substrate formation for advanced packaging applications

Reconstituted substrate for radio frequency applications

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Methods and apparatus for semiconductor package processing

Methods of TSV formation for advanced packaging

Methods of forming through-silicon vias in substrates for advanced packaging

Methods for chemical mechanical polishing (CMP) processing with ozone

Procedure to enable die rework for hybrid bonding

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Methods, systems, and apparatus for tape-frame substrate cleaning and drying

Methods, systems, and apparatus for tape-frame substrate cleaning and drying

Semiconductor substrate having magnetic core inductor

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Method of forming a magnetic core on a substrate

Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applications

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Slurry for polishing of integrated circuit packaging

Method and apparatus for wafer level packaging

Method of ultra thinning of wafer

Self-aligned wide backside power rail contacts to multiple transistor sources

Methods of TSV formation for advanced packaging

Silicon (Si) dry etch for die-to-wafer thinning

Reconstituted substrate for radio frequency applications

Methods for bonding substrates

Methods and apparatus for controlling warpage in wafer level packaging processes

Water vapor plasma to enhance surface hydrophilicity

Methods and apparatus for processing a substrate

Methods and apparatus for processing a substrate

Integrated process flows for hybrid bonding

Method of fine redistribution interconnect formation for advanced packaging applications

Methods and apparatus for backside via reveal processing

Methods for forming vias in polymer layers

Methods for forming microwave tunable composited thin-film dielectric layer

Methods for forming alignment marks

On-board cleaning of tooling parts in hybrid bonding tool

Apparatus for environmental control of dies and substrates for hybrid bonding

Methods and apparatus for 3D MIM capacitor package processing

Methods of enhancing polymer adhesion to copper

GLOBALFOUNDRIES SG PTE LTD

Integrated circuits with contacts through a buried oxide layer and methods of producing the same

Grounding of silicon-on-insulator structure

Integrated circuits with deep and ultra shallow trench isolations and methods for fabricating the same

Extended drain metal-oxide-semiconductor transistor

Integrated circuits using silicon on insulator substrates and methods of manufacturing the same

Extended drain metal-oxide-semiconductor transistor

Silicon-on-insulator integrated circuit devices with body contact structures and methods for fabricating the same

Silicon-on-insulator integrated circuits with local oxidation of silicon and methods for fabricating the same

Silicon-on-insulator integrated circuit devices with body contact structures

SEE GUAN HUEI

Structure and method of fabricating three-dimensional (3D) metal-insulator-metal (MIM) capacitor and resistor in semi-additive plating metal wiring