Inventor

SUNDARRAJAN ARVIND

SG62 patents

⚠️ This page may combine multiple inventors who share the name “SUNDARRAJAN ARVIND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUNDARRAJAN ARVIND

APPLIED MATERIALS INC

Method for forming a multilayered aluminum-comprising structure on a substrate

Method of redistribution layer formation for advanced packaging applications

Method of reconstituted substrate formation for advanced packaging applications

Methods and apparatus for ionized metal plasma copper deposition with enhanced in-film particle performance

Physical vapor deposition apparatus with deposition and DC target power control

Method for improved chamber bake-out and cool-down

Enhanced cooling IMP coil support

Pressure modulation method to obtain improved step coverage of seed layer

Method for removing native oxide and associated residue from a substrate

Multi-step process for forming a metal barrier in a sputter reactor

Temperature control of a substrate

Methods and apparatus for wafer-level die bridge

Self-ionized and inductively-coupled plasma for sputtering and resputtering

Method for improved chamber bake-out and cool-down

Methods and apparatus for semiconductor package processing

Methods of TSV formation for advanced packaging

Methods of forming through-silicon vias in substrates for advanced packaging

Methods for chemical mechanical polishing (CMP) processing with ozone

Hermetic CVD-cap with improved step coverage in high aspect ratio structures

Step coverage dielectric

Methods for reducing damage to substrate layers in deposition processes

Semiconductor substrate having magnetic core inductor

Method of forming a magnetic core on a substrate

Slurry for polishing of integrated circuit packaging

Method and apparatus for wafer level packaging

Substrate vacuum transport and storage apparatus

Sealing structure for workpiece to substrate bonding in a processing chamber

Multi-cassette carrying case

Method of ultra thinning of wafer

Self-aligned wide backside power rail contacts to multiple transistor sources

Enhanced cooling IMP coil support

Methods of TSV formation for advanced packaging

Silicon (Si) dry etch for die-to-wafer thinning

Methods for bonding substrates

Methods and apparatus for controlling warpage in wafer level packaging processes

Water vapor plasma to enhance surface hydrophilicity

Methods and apparatus for processing a substrate

Methods and apparatus for processing a substrate

Methods and apparatus for processing a substrate

Methods and apparatus for backside via reveal processing

Methods for forming vias in polymer layers

Method and apparatus for backside cleaning of substrates

ZHENG BO

Method for removing native oxide and associated residue from a substrate

Method for removing native oxide and associated residue from a substrate

Methods of end point detection for substrate fabrication processes

DING PEIJUN

Self-ionized and inductively-coupled plasma for sputtering and resputtering

Self-ionized and inductively-coupled plasma for sputtering and resputtering

GUNG TZA-JING

Electromagnet array in a sputter reactor

CHANG MEI

Methods for contact clean

NARWANKAR PRAVIN K

BEOL interconnect with carbon nanotubes