Inventor
MORI GLEN T
US18 patents
⚠️ This page may combine multiple inventors who share the name “MORI GLEN T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
17 patentsUS9171714B2Oct 27, 2015
Integrated processing of porous dielectric, polymer-coated substrates and epoxy within a multi-chamber vacuum system confirmation
APPLIED MATERIALS INC521 citations98
US6416634B1Jul 9, 2002
Method and apparatus for reducing target arcing during sputter deposition
APPLIED MATERIALS INC56 citations93
US6777045B2Aug 17, 2004
Chamber components having textured surfaces and method of manufacture
APPLIED MATERIALS INC63 citations92
US6428663B1Aug 6, 2002
Preventing defect generation from targets through applying metal spray coatings on sidewalls
APPLIED MATERIALS INC19 citations90
US6933025B2Aug 23, 2005
Chamber having components with textured surfaces and method of manufacture
APPLIED MATERIALS INC32 citations88
US6116032ASep 12, 2000
Method for reducing particulate generation from regeneration of cryogenic vacuum pumps
APPLIED MATERIALS INC25 citations86
US10629430B2Apr 21, 2020
Variable frequency microwave (VFM) processes and applications in semiconductor thin film fabrications
APPLIED MATERIALS INC4 citations70
US9960035B2May 1, 2018
Variable frequency microwave (VFM) processes and applications in semiconductor thin film fabrications
APPLIED MATERIALS INC2 citations70
US9548200B2Jan 17, 2017
Variable frequency microwave (VFM) processes and applications in semiconductor thin film fabrications
APPLIED MATERIALS INC3 citations70
US12424481B2Sep 23, 2025
Modular substrate support assembly
APPLIED MATERIALS INC0 citations60
US6379428B1Apr 30, 2002
Method for reducing particle concentration within a semiconductor device fabrication tool
APPLIED MATERIALS INC5 citations60
US11587799B2Feb 21, 2023
Methods and apparatus for processing a substrate
APPLIED MATERIALS INC0 citations59
US9147558B2Sep 29, 2015
Finned shutter disk for a substrate process chamber
APPLIED MATERIALS INC2 citations59
US9051655B2Jun 9, 2015
Boron ionization for aluminum oxide etch enhancement
APPLIED MATERIALS INC1 citations52
US11289387B2Mar 29, 2022
Methods and apparatus for backside via reveal processing
APPLIED MATERIALS INC0 citations51
US9269562B2Feb 23, 2016
In situ chamber clean with inert hydrogen helium mixture during wafer process
APPLIED MATERIALS INC1 citations50
US9177782B2Nov 3, 2015
Methods and apparatus for cleaning a substrate
APPLIED MATERIALS INC1 citations46