Inventor
SHANKAR NAGRAJ
US32 patents
⚠️ This page may combine multiple inventors who share the name “SHANKAR NAGRAJ”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
30 patentsUS10002787B2Jun 19, 2018
Staircase encapsulation in 3D NAND fabrication
LAM RES CORP28 citations94
US9214334B2Dec 15, 2015
High growth rate process for conformal aluminum nitride
LAM RES CORP38 citations94
US10665501B2May 26, 2020
Deposition of Aluminum oxide etch stop layers
LAM RES CORP22 citations93
US9859153B1Jan 2, 2018
Deposition of aluminum oxide etch stop layers
LAM RES CORP19 citations93
US9190489B1Nov 17, 2015
Sacrificial pre-metal dielectric for self-aligned contact scheme
LAM RES CORP31 citations93
US10580690B2Mar 3, 2020
Staircase encapsulation in 3D NAND fabrication
LAM RES CORP15 citations86
US9418889B2Aug 16, 2016
Selective formation of dielectric barriers for metal interconnects in semiconductor devices
LAM RES CORP8 citations84
US9153482B2Oct 6, 2015
Methods and apparatus for selective deposition of cobalt in semiconductor processing
LAM RES CORP14 citations84
US10559461B2Feb 11, 2020
Selective deposition with atomic layer etch reset
LAM RES CORP10 citations83
US9379210B2Jun 28, 2016
Sacrificial pre-metal dielectric for self-aligned contact scheme
LAM RES CORP7 citations83
US10566194B2Feb 18, 2020
Selective deposition of etch-stop layer for enhanced patterning
LAM RES CORP5 citations82
US9633896B1Apr 25, 2017
Methods for formation of low-k aluminum-containing etch stop films
LAM RES CORP11 citations82
US10998187B2May 4, 2021
Selective deposition with atomic layer etch reset
LAM RES CORP2 citations72
US10418236B2Sep 17, 2019
Composite dielectric interface layers for interconnect structures
LAM RES CORP3 citations72
US10199235B2Feb 5, 2019
Liner and barrier applications for subtractive metal integration
LAM RES CORP2 citations72
US10049869B2Aug 14, 2018
Composite dielectric interface layers for interconnect structures
LAM RES CORP4 citations72
US11427908B2Aug 30, 2022
Manifold valve for multiple precursors
LAM RES CORP2 citations71
US11094542B2Aug 17, 2021
Selective deposition of etch-stop layer for enhanced patterning
LAM RES CORP2 citations71
US10643889B2May 5, 2020
Pre-treatment method to improve selectivity in a selective deposition process
LAM RES CORP2 citations71
US10472716B1Nov 12, 2019
Showerhead with air-gapped plenums and overhead isolation gas distributor
LAM RES CORP4 citations69
US11869770B2Jan 9, 2024
Selective deposition of etch-stop layer for enhanced patterning
LAM RES CORP0 citations60
US11859282B2Jan 2, 2024
Manifold valve for controlling multiple gases
LAM RES CORP0 citations60
US12516417B2Jan 6, 2026
Faceless showerhead
LAM RES CORP0 citations53
US12040180B2Jul 16, 2024
Nitride films with improved etch selectivity for 3D NAND integration
LAM RES CORP0 citations51
US10804144B2Oct 13, 2020
Deposition of aluminum oxide etch stop layers
LAM RES CORP0 citations51
US9899234B2Feb 20, 2018
Liner and barrier applications for subtractive metal integration
LAM RES CORP1 citations51
US10900124B2Jan 26, 2021
Substrate processing chamber with showerhead having cooled faceplate
LAM RES CORP0 citations50
US10745806B2Aug 18, 2020
Showerhead with air-gapped plenums and overhead isolation gas distributor
LAM RES CORP0 citations48
US12080592B2Sep 3, 2024
Film stack simplification for high aspect ratio patterning and vertical scaling
LAM RES CORP0 citations46
US10651080B2May 12, 2020
Oxidizing treatment of aluminum nitride films in semiconductor device manufacturing
LAM RES CORP0 citations39