Inventor
ZITZ JEFFREY ALLEN
US15 patents
Patents
15 patentsUS6740959B2May 25, 2004
EMI shielding for semiconductor chip carriers
IBM97 citations94
US7394659B2Jul 1, 2008
Apparatus and methods for cooling semiconductor integrated circuit package structures
IBM50 citations92
US6774482B2Aug 10, 2004
Chip cooling
IBM44 citations92
US10842043B1Nov 17, 2020
Fabricating coolant-cooled heat sinks with internal thermally-conductive fins
IBM22 citations91
US6413353B2Jul 2, 2002
Method for direct attachment of a chip to a cooling member
IBM68 citations91
US7768121B2Aug 3, 2010
Apparatus and methods for cooling semiconductor integrated circuit package structures
IBM13 citations84
US7288839B2Oct 30, 2007
Apparatus and methods for cooling semiconductor integrated circuit package structures
IBM11 citations84
US11800666B2Oct 24, 2023
Temporary removable module lid
IBM4 citations74
US11156409B2Oct 26, 2021
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover
IBM6 citations71
US6964885B2Nov 15, 2005
Stress resistant land grid array (LGA) module and method of forming the same
IBM9 citations71
US6703560B2Mar 9, 2004
Stress resistant land grid array (LGA) module and method of forming the same
IBM7 citations71
US7803664B2Sep 28, 2010
Apparatus and methods for cooling semiconductor integrated circuit package structures
IBM7 citations70
US12028997B2Jul 2, 2024
Rotating lid for module cooler
IBM0 citations62
US12431404B2Sep 30, 2025
Fatigue failure resistant electronic package
IBM0 citations52
US11264306B2Mar 1, 2022
Hybrid TIMs for electronic package cooling
IBM0 citations49