Inventor
YOSHINO MAKOTO
66 patents
⚠️ This page may combine multiple inventors who share the name “YOSHINO MAKOTO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK CORP
15 patentsUS9293913B2Mar 22, 2016
ESD protection component and method for manufacturing ESD protection component
TDK CORP8 citations82
US10848119B2Nov 24, 2020
Electronic component
TDK CORP2 citations72
US11227721B2Jan 18, 2022
Electronic component
TDK CORP4 citations71
US10115515B2Oct 30, 2018
Multilayer common mode filter
TDK CORP2 citations70
US11527350B2Dec 13, 2022
Multilayer coil component
TDK CORP0 citations62
US11894195B2Feb 6, 2024
Electronic component
TDK CORP0 citations61
US11127529B2Sep 21, 2021
Method of manufacturing laminated coil component
TDK CORP0 citations61
US12347596B2Jul 1, 2025
Multi-layer inductor
TDK CORP0 citations60
US8957744B2Feb 17, 2015
Multilayer common mode filter
TDK CORP2 citations60
US12125627B2Oct 22, 2024
Multilayer inductor component
TDK CORP0 citations51
US12094642B2Sep 17, 2024
Multilayer inductor component
TDK CORP0 citations51
US12040122B2Jul 16, 2024
Multilayer coil component
TDK CORP0 citations51
US11830664B2Nov 28, 2023
Multilayer coil component
TDK CORP0 citations51
US11791088B2Oct 17, 2023
Multilayer coil component
TDK CORP0 citations51
US11735347B2Aug 22, 2023
Multilayer coil component
TDK CORP0 citations51
TEXAS INSTRUMENTS INC
13 patentsUS9896330B2Feb 20, 2018
Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
TEXAS INSTRUMENTS INC12 citations90
US10233074B2Mar 19, 2019
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
TEXAS INSTRUMENTS INC4 citations82
US8048358B2Nov 1, 2011
Pop semiconductor device manufacturing method
TEXAS INSTRUMENTS INC12 citations79
US11498831B2Nov 15, 2022
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
TEXAS INSTRUMENTS INC1 citations71
US10763231B2Sep 1, 2020
Bump bond structure for enhanced electromigration performance
TEXAS INSTRUMENTS INC2 citations71
US10723616B2Jul 28, 2020
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
TEXAS INSTRUMENTS INC2 citations71
US12021019B2Jun 25, 2024
Semiconductor device package with thermal pad
TEXAS INSTRUMENTS INC2 citations67
US6894374B2May 17, 2005
Semiconductor package insulation film and manufacturing method thereof
TEXAS INSTRUMENTS INC5 citations63
US6875637B2Apr 5, 2005
Semiconductor package insulation film and manufacturing method thereof
TEXAS INSTRUMENTS INC6 citations63
US12046542B2Jul 23, 2024
Heat-dissipating wirebonded members on package surfaces
TEXAS INSTRUMENTS INC0 citations62
US11450638B2Sep 20, 2022
Bump bond structure for enhanced electromigration performance
TEXAS INSTRUMENTS INC0 citations60
US10283409B2May 7, 2019
Integrated clip and lead and method of making a circuit
TEXAS INSTRUMENTS INC0 citations52
US9673097B2Jun 6, 2017
Integrated clip and lead and method of making a circuit
TEXAS INSTRUMENTS INC0 citations52
DENSO CORP
7 patentsUS7810848B2Oct 12, 2010
Pipe joint and pipe joint structure having the same and method of using the same
DENSO CORP26 citations92
US7611171B2Nov 3, 2009
Piping joint device
DENSO CORP8 citations84
US7354078B2Apr 8, 2008
Pipe joint device
DENSO CORP9 citations84
US7178837B2Feb 20, 2007
Piping joint structure
DENSO CORP14 citations84
US7007981B2Mar 7, 2006
Connecting structure of pipe and pipe joint and method of connecting the pipe to the pipe joint
DENSO CORP10 citations74
US7753413B2Jul 13, 2010
Vapour-compression type refrigerating machine and double pipe structure and double pipe joint structure preferably used therefor
DENSO CORP7 citations72
US7837234B2Nov 23, 2010
Pipe joint unit and method of manufacturing the same
DENSO CORP5 citations59
YOSHINO MAKOTO
4 patentsUS9255657B2Feb 9, 2016
Pipe joint
YOSHINO MAKOTO4 citations72
US9231907B2Jan 5, 2016
Method for establishing connection between communication apparatuses, communication apparatus, and server apparatus
YOSHINO MAKOTO4 citations72
US8205667B2Jun 26, 2012
Heat exchanger with connector
YOSHINO MAKOTO6 citations72
US8466757B2Jun 18, 2013
Multilayer common mode filter
YOSHINO MAKOTO3 citations59
TOKAI RUBBER IND LTD
2 patentsTOHO CHEM IND CO LTD
2 patentsUMEDA HIDENOBU
1 patentTOYOTA JIDOSHOKKI KK
1 patentHITACHI LTD
1 patentNIPPON DENSO CO
1 patentFUJITSU LTD
1 patentDIRECTOR GENERAL CHUBU REGIONA
1 patentPANASONIC IP MAN CO LTD
1 patentShowing the top 50 of 66 patents by PatentIndex Score.