Inventor
WOLF GERHARD D
DE33 patents
Patents
33 patentsUS4847139AJul 11, 1989
Flexible circuits
BAYER AG54 citations96
US4522889AJun 11, 1985
Lightning protection composite material
BAYER AG82 citations96
US4472458ASep 18, 1984
Process for the production of metallized semiconductors
BAYER AG68 citations96
US5182135AJan 26, 1993
Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
BAYER AG79 citations95
US5233753AAug 10, 1993
Method of making injection-moulded printed circuit boards
BAYER AG24 citations92
US4910045AMar 20, 1990
Process for improving the adhesive strength of electrolessly deposited metal layers on polyimide surfaces
BAYER AG24 citations92
US4764401AAug 16, 1988
Process for activating substrate surfaces for electroless metallization
BAYER AG26 citations92
US4572960AFeb 25, 1986
Use of metallized knitted net fabrics for protection against microwave radiation
BAYER AG50 citations92
US4493861AJan 15, 1985
Process for activating substrate surfaces for currentless metallization
BAYER AG30 citations92
US4481249ANov 6, 1984
Metallized carbon fibres and composite materials containing these fibres
BAYER AG27 citations92
US4252652AFeb 24, 1981
Process of using a semi-permeable membrane of acrylonitrile copolymers
BAYER AG41 citations92
US4753821AJun 28, 1988
Process for the partial metallization of substrate surfaces
BAYER AG52 citations90
US4217227AAug 12, 1980
Semipermeable membranes of copolyamides
BAYER AG33 citations90
US5378268AJan 3, 1995
Primer for the metallization of substrate surfaces
BAYER AG23 citations89
US4804475AFeb 14, 1989
Metallized membrane systems
BAYER AG22 citations82
US4269967AMay 26, 1981
Semipermeable membranes of aromatic disulfimide containing polyamides
BAYER AG24 citations81
US4830714AMay 16, 1989
Process for the production of printed circuit boards
BAYER AG12 citations74
US4728560AMar 1, 1988
Electrical printed circuit boards
BAYER AG7 citations74
US4661384AApr 28, 1987
Process for activating substrate surfaces for electroless metallization
BAYER AG17 citations74
US4636441AJan 13, 1987
Semi-finished products for the manufacture of printed circuit boards
BAYER AG9 citations74
US4614684ASep 30, 1986
Reinforced composite comprising resin impregnated metallized polyaramide fabric and method of making same
BAYER AG16 citations74
US4575467AMar 11, 1986
Process for activating substrates for electroless metallization
BAYER AG14 citations74
US4568571AFeb 4, 1986
Process for the adhesion-activation of polyamide substrates for electroless metallization
BAYER AG12 citations74
US4554183ANov 19, 1985
Process for pretreating polyamide substrates for electroless metallization
BAYER AG8 citations74
US4542074ASep 17, 1985
Surface metallized semiconductors
BAYER AG6 citations74
US4832989AMay 23, 1989
Method of improving the bond strength of electrolessly deposited metal layers on plastic-material surfaces
BAYER AG19 citations73
US4913768AApr 3, 1990
Process for producing electrical conductor boards
BAYER AG12 citations71
US4245110AJan 13, 1981
Polyalkylene oxide-containing urethane polyols with sulphonic acid groups
BAYER AG17 citations69
US4221903ASep 9, 1980
Semipermeable membranes of heterocyclic copolyamides
BAYER AG9 citations69
US4622411ANov 11, 1986
Organopalladium-II-complex compounds
BAYER AG3 citations63
US5176743AJan 5, 1993
Formulation of activating substrate surfaces for their electroless metallization
BAYER AG3 citations62
US4440892AApr 3, 1984
Agents having a tumor-inhibiting action and their use
BAYER AG1 citations51
US4166186AAug 28, 1979
Dihydroxy carbamates containing sulphonic acid groups
BAYER AG0 citations51