Inventor · disambiguated record
Kiyoshi Iyogi
Also filed as: IYOGI KIYOSHI
14 granted patents·516 citations·filing 1985–2000
95Inventor score
Files withTOSHIBA KK14
Top patents by PatentIndex Score
14 records- 0188US6426154B1Ceramic circuit boardTOSHIBA KK·Filed 2000·Granted Jul 30, 2002·54 cites·28 claims
- 0285US5714801ASemiconductor packageTOSHIBA KK·Filed 1996·Granted Feb 3, 1998·81 cites·12 claims
- 0383US4924033ABrazing paste for bonding metal and ceramicTOSHIBA KK·Filed 1989·Granted May 8, 1990·54 cites·9 claims
- 0483US4659611ACircuit substrate having high thermal conductivityTOSHIBA KK·Filed 1985·Granted Apr 21, 1987·64 cites·25 claims
- 0580US5736790ASemiconductor chip, package and semiconductor deviceTOSHIBA KK·Filed 1996·Granted Apr 7, 1998·46 cites·20 claims
- 0680US4835344AElectronic component parts and method for manufacturing the sameTOSHIBA KK·Filed 1988·Granted May 30, 1989·47 cites·15 claims
- 0779US5907187AElectronic component and electronic component connecting structureTOSHIBA KK·Filed 1995·Granted May 25, 1999·57 cites·12 claims
- 0865US5412160ACircuit boardTOSHIBA KK·Filed 1994·Granted May 2, 1995·33 cites·7 claims
- 0956US5326623ACircuit boardTOSHIBA KK·Filed 1993·Granted Jul 5, 1994·23 cites·18 claims
- 1048US5041700ACircuit board including an aluminum nitride substrate and a multilayered metal oxynitride structureTOSHIBA KK·Filed 1990·Granted Aug 20, 1991·18 cites·20 claims
- 1146US5622769ACeramic circuit board having a thermal conductivity substrateTOSHIBA KK·Filed 1994·Granted Apr 22, 1997·15 cites·5 claims
- 1242US4855251AMethod of manufacturing electronic parts including transfer of bumps of larger particle sizesTOSHIBA KK·Filed 1988·Granted Aug 8, 1989·10 cites·9 claims
- 1341US5019187ABrazing paste for bonding metal and ceramicTOSHIBA KK·Filed 1990·Granted May 28, 1991·10 cites·14 claims
- 1433US4919731ABrazing pasteTOSHIBA KK·Filed 1989·Granted Apr 24, 1990·4 cites·9 claims
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