Inventor
CHANG CHENG-CHENG
US11 patents
⚠️ This page may combine multiple inventors who share the name “CHANG CHENG-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD CO
4 patentsUS6011314AJan 4, 2000
Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps
HEWLETT PACKARD CO189 citations96
US5031073AJul 9, 1991
Fault-isolating apparatus and method for connecting circuitry
HEWLETT PACKARD CO32 citations92
US4956749ASep 11, 1990
Interconnect structure for integrated circuits
HEWLETT PACKARD CO35 citations92
US5132879AJul 21, 1992
Secondary board for mounting of components having differing bonding requirements
HEWLETT PACKARD CO20 citations79