Inventor
CHOU WILLIAM T
US28 patents
Patents
28 patentsUS6187652B1Feb 13, 2001
Method of fabrication of multiple-layer high density substrate
FUJITSU LTD177 citations98
US5854534ADec 29, 1998
Controlled impedence interposer substrate
FUJITSU LTD238 citations98
US5660957AAug 26, 1997
Electron-beam treatment procedure for patterned mask layers
FUJITSU LTD135 citations98
US5722162AMar 3, 1998
Fabrication procedure for a stable post
FUJITSU LTD97 citations97
US6733685B2May 11, 2004
Methods of planarizing structures on wafers and substrates by polishing
FUJITSU LTD64 citations96
US6102710AAug 15, 2000
Controlled impedance interposer substrate and method of making
FUJITSU LTD68 citations96
US6081026AJun 27, 2000
High density signal interposer with power and ground wrap
FUJITSU LTD61 citations96
US5544017AAug 6, 1996
Multichip module substrate
FUJITSU LTD91 citations96
US5455064AOct 3, 1995
Process for fabricating a substrate with thin film capacitor and insulating plug
FUJITSU LTD57 citations96
US5419038AMay 30, 1995
Method for fabricating thin-film interconnector
FUJITSU LTD96 citations96
US5891354AApr 6, 1999
Methods of etching through wafers and substrates with a composite etch stop layer
FUJITSU LTD50 citations93
US5789140AAug 4, 1998
Method of forming a pattern or via structure utilizing supplemental electron beam exposure and development to remove image residue
FUJITSU LTD25 citations93
US6662443B2Dec 16, 2003
Method of fabricating a substrate with a via connection
FUJITSU LTD47 citations92
US6226171B1May 1, 2001
Power conducting substrates with high-yield integrated substrate capacitor
FUJITSU LTD24 citations92
US6197664B1Mar 6, 2001
Method for electroplating vias or through holes in substrates having conductors on both sides
FUJITSU LTD35 citations92
US5916453AJun 29, 1999
Methods of planarizing structures on wafers and substrates by polishing
FUJITSU LTD38 citations92
US5652693AJul 29, 1997
Substrate with thin film capacitor and insulating plug
FUJITSU LTD25 citations92
US5475262ADec 12, 1995
Functional substrates for packaging semiconductor chips
FUJITSU LTD39 citations92
US5382827AJan 17, 1995
Functional substrates for packaging semiconductor chips
FUJITSU LTD44 citations92
US5376586ADec 27, 1994
Method of curing thin films of organic dielectric material
FUJITSU LTD23 citations92
US5323520AJun 28, 1994
Process for fabricating a substrate with thin film capacitor
FUJITSU LTD35 citations92
US5406446AApr 11, 1995
Thin film capacitor
FUJITSU LTD17 citations82
US5942373AAug 24, 1999
Pattern or via structure formed through supplemental electron beam exposure and development to remove image residue
FUJITSU LTD13 citations74
US5746903AMay 5, 1998
Wet chemical processing techniques for plating high aspect ratio features
FUJITSU LTD14 citations74
US5930890AAug 3, 1999
Structure and fabrication procedure for a stable post
FUJITSU LTD12 citations73
US5778529AJul 14, 1998
Method of making a multichip module substrate
FUJITSU LTD10 citations73
US5458731AOct 17, 1995
Method for fast and non-destructive examination of etched features
FUJITSU LTD4 citations63
US6221567B1Apr 24, 2001
Method of patterning polyamic acid layers
FUJITSU LTD4 citations60