Inventor · disambiguated record
Kazuma Miura
Also filed as: MIURA KAZUMA
9 granted patents·2 pending applications·270 citations·filing 2001–2020
90Inventor score
Files withHITACHI LTD4FUJI CORP2RENESAS TECH CORP2NAT INST FOR MATERIALS SCIENCE1RENESAS ELECTRONICS CORP1
Top patents by PatentIndex Score
11 records- 0194US6563225B2Product using Zn-Al alloy solderHITACHI LTD·Filed 2002·Granted May 13, 2003·110 cites·17 claims
- 0288US8022551B2Solder composition for electronic devicesRENESAS ELECTRONICS CORP·Filed 2006·Granted Sep 20, 2011·13 cites·11 claims
- 0388US7875128B2Method for manufacturing a stainless steel product and a stainless steel product manufactured by the methodNAT INST FOR MATERIALS SCIENCE·Filed 2007·Granted Jan 25, 2011·9 cites·5 claims
- 0488US7145236B2Semiconductor device having solder bumps reliably reflow solderableRENESAS TECH CORP·Filed 2002·Granted Dec 5, 2006·47 cites·7 claims
- 0587US6486411B2Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrateHITACHI LTD·Filed 2001·Granted Nov 26, 2002·43 cites·26 claims
- 0676US7075183B2Electronic deviceHITACHI LTD·Filed 2001·Granted Jul 11, 2006·18 cites·9 claims
- 0770US7722962B2Solder foil, semiconductor device and electronic deviceRENESAS TECH CORP·Filed 2001·Granted May 25, 2010·18 cites·5 claims
- 0869US7259465B2Semiconductor device with lead-free solderHITACHI LTD·Filed 2002·Granted Aug 21, 2007·12 cites·20 claims
- 0957US12392553B2Drying device and drying methodFUJI CORP·Filed 2019·Granted Aug 19, 2025·0 cites·6 claims
- 1051US2023079097A1Drying device, and nozzle drying methodFUJI CORP·Filed 2020·Application pending·0 cites
- 1134US2004177997A1Electronic apparatusFiled 2002·Application pending·0 cites
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