Inventor · disambiguated record
Hanae Shimokawa
Also filed as: SHIMOKAWA HANAE
19 granted patents·1 pending application·453 citations·filing 1995–2016
96Inventor score
Files withHITACHI LTD11HITACHI AUTOMOTIVE SYSTEMS LTD2RENESAS ELECTRONICS CORP2RENESAS TECH CORP2SHIMOKAWA HANAE1
Top patents by PatentIndex Score
20 records- 0191US5867809AElectric appliance, printed circuit board, remained life estimation method, and system thereofHITACHI LTD·Filed 1995·Granted Feb 2, 1999·142 cites·17 claims
- 0288US8022551B2Solder composition for electronic devicesRENESAS ELECTRONICS CORP·Filed 2006·Granted Sep 20, 2011·13 cites·11 claims
- 0388US7145236B2Semiconductor device having solder bumps reliably reflow solderableRENESAS TECH CORP·Filed 2002·Granted Dec 5, 2006·47 cites·7 claims
- 0487US6486411B2Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrateHITACHI LTD·Filed 2001·Granted Nov 26, 2002·43 cites·26 claims
- 0586US8004075B2Semiconductor power module including epoxy resin coatingHITACHI LTD·Filed 2007·Granted Aug 23, 2011·13 cites·12 claims
- 0686US6555052B2Electron device and semiconductor deviceHITACHI LTD·Filed 2001·Granted Apr 29, 2003·42 cites·18 claims
- 0778US8503189B2Pb-free solder-connected structure and electronic deviceSHIMOKAWA HANAE·Filed 2010·Granted Aug 6, 2013·3 cites·11 claims
- 0877US6774490B2Electronic deviceHITACHI LTD·Filed 2003·Granted Aug 10, 2004·22 cites·10 claims
- 0976US7075183B2Electronic deviceHITACHI LTD·Filed 2001·Granted Jul 11, 2006·18 cites·9 claims
- 1075US5942185ALead-free solder used for connecting electronic parts on organic substrate and electronic products made using sameHITACHI LTD·Filed 1997·Granted Aug 24, 1999·37 cites·13 claims
- 1173US8125090B2Semiconductor power moduleSOGA TASAO·Filed 2010·Granted Feb 28, 2012·4 cites·13 claims
- 1272US10247630B2Semiconductor device, mechanical quantity measuring device, and semiconductor device fabricating methodHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2016·Granted Apr 2, 2019·2 cites·18 claims
- 1372US7013564B2Method of producing an electronic device having a PB free solder connectionHITACHI LTD·Filed 2001·Granted Mar 21, 2006·10 cites·19 claims
- 1472US6204490B1Method and apparatus of manufacturing an electronic circuit boardHITACHI LTD·Filed 1999·Granted Mar 20, 2001·33 cites·21 claims
- 1570US10481023B2Mechanical quantity measuring device and sensor unitHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2015·Granted Nov 19, 2019·2 cites·14 claims
- 1670US7709746B2Pb-free solder-connected structure and electronic deviceRENESAS TECH CORP·Filed 2006·Granted May 4, 2010·3 cites·13 claims
- 1769US7259465B2Semiconductor device with lead-free solderHITACHI LTD·Filed 2002·Granted Aug 21, 2007·12 cites·20 claims
- 1867US6960396B2Pb-free solder-connected structure and electronic deviceHITACHI LTD·Filed 2002·Granted Nov 1, 2005·7 cites·27 claims
- 1960US8907475B2Pb-free solder-connected structureRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 9, 2014·0 cites·12 claims
- 2035US2002009610A1Technical fieldFiled 2001·Application pending·0 cites
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