Inventor · disambiguated record
Koji Serizawa
Also filed as: SERIZAWA KOJI
11 granted patents·2 pending applications·345 citations·filing 1978–2007
93Inventor score
Top patents by PatentIndex Score
13 records- 0188US7145236B2Semiconductor device having solder bumps reliably reflow solderableRENESAS TECH CORP·Filed 2002·Granted Dec 5, 2006·47 cites·7 claims
- 0287US6486411B2Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrateHITACHI LTD·Filed 2001·Granted Nov 26, 2002·43 cites·26 claims
- 0386US6555052B2Electron device and semiconductor deviceHITACHI LTD·Filed 2001·Granted Apr 29, 2003·42 cites·18 claims
- 0481US5804872AFilm carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereofHITACHI LTD·Filed 1997·Granted Sep 8, 1998·53 cites·6 claims
- 0580US4326238AElectronic circuit packagesFUJITSU LTD·Filed 1978·Granted Apr 20, 1982·39 cites·38 claims
- 0677US6774490B2Electronic deviceHITACHI LTD·Filed 2003·Granted Aug 10, 2004·22 cites·10 claims
- 0772US6204490B1Method and apparatus of manufacturing an electronic circuit boardHITACHI LTD·Filed 1999·Granted Mar 20, 2001·33 cites·21 claims
- 0869US5760997AFlexible cable structure for magnetic disk drivesIBM·Filed 1997·Granted Jun 2, 1998·31 cites·30 claims
- 0958US5631497AFilm carrier tape and laminated multi-chip semiconductor device incorporating the sameHITACHI LTD·Filed 1991·Granted May 20, 1997·21 cites·24 claims
- 1052US6297074B1Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereofHITACHI LTD·Filed 1995·Granted Oct 2, 2001·14 cites·24 claims
- 1148US7911062B2Electronic component with varying rigidity leads using Pb-free solderHITACHI LTD·Filed 2007·Granted Mar 22, 2011·0 cites·30 claims
- 1244US2008062665A1Mounting structureNAKATSUKA TETSUYA·Filed 2007·Application pending·0 cites
- 1341US2008261001A1Mounting Substrate Suitable for Use to Install Surface Mount ComponentsNAKATSUKA TETSUYA·Filed 2005·Application pending·0 cites
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