Inventor
GAN QING
US10 patents
⚠️ This page may combine multiple inventors who share the name “GAN QING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AGILENT TECHNOLOGIES INC
6 patentsUS6777263B1Aug 17, 2004
Film deposition to enhance sealing yield of microcap wafer-level package with vias
AGILENT TECHNOLOGIES INC241 citations98
US6903012B2Jun 7, 2005
Sloped via contacts
AGILENT TECHNOLOGIES INC81 citations97
US6787897B2Sep 7, 2004
Wafer-level package with silicon gasket
AGILENT TECHNOLOGIES INC65 citations94
US6777267B2Aug 17, 2004
Die singulation using deep silicon etching
AGILENT TECHNOLOGIES INC41 citations92
US6979597B2Dec 27, 2005
Wafer-level package with silicon gasket
AGILENT TECHNOLOGIES INC32 citations91
US6763702B2Jul 20, 2004
Method and apparatus for hermeticity determination and leak detection in semiconductor packaging
AGILENT TECHNOLOGIES INC17 citations82
SKYWORKS SOLUTIONS INC
3 patentsUS7629201B2Dec 8, 2009
Method for fabricating a wafer level package with device wafer and passive component integration
SKYWORKS SOLUTIONS INC27 citations90
US7576426B2Aug 18, 2009
Wafer level package including a device wafer integrated with a passive component
SKYWORKS SOLUTIONS INC31 citations90
US7696064B2Apr 13, 2010
Methods for forming a through via
SKYWORKS SOLUTIONS INC5 citations61