Inventor

BIRNER ALBERT

DE61 patents

⚠️ This page may combine multiple inventors who share the name “BIRNER ALBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BIRNER ALBERT

INFINEON TECHNOLOGIES AG

Method of forming a silicon dioxide layer

Through substrate via semiconductor components

Process for the electrochemical oxidation of a semiconductor substrate

Through vias and methods of formation thereof

Semiconductor device

Method for manufacturing a semiconductor device

Memory cell with trench capacitor and vertical select transistor and an annular contact-making region formed between them

Method for fabricating a memory cell

Semiconductor trench structure

Barrier layer and a method for suppressing diffusion processes during the production of semiconductor devices

Method for fabricating trench capacitors and semiconductor device with trench capacitors

Configuration and method for making contact with the back surface of a semiconductor substrate

Method for fabricating a trench structure

Method of forming a vertical field-effect transistor device

LDMOS transistor and method

Segmented bond pads and methods of fabrication thereof

Substrate and method

Method for forming an SOI substrate, vertical transistor and memory cell with vertical transistor

Method and layout of semiconductor device with reduced parasitics

Transistor arrangement in monocrystalline substrate having stress exerting insulators

Method and configuration for reinforcement of a dielectric layer at defects by self-aligning and self-limiting electrochemical conversion of a substrate material

Method for making electrical contact with a rear side of a semiconductor substrate during its processing

Group III nitride-based transistor device having a conductive redistribution structure

Selective laser annealing method

Group III nitride device and method of fabricating a Group III nitride-based device

Group III nitride-based transistor device having a field plate

Semiconductor device and method of fabricating a semiconductor device

Selective thermal annealing method

Semiconductor device and method of fabricating a semiconductor device

Through vias and methods of formation thereof

Through substrate via semiconductor components and methods of formation thereof

Method for fabricating a vertical transistor in a trench, and vertical transistor

Group III nitride device having an ohmic contact

Group III nitride device and method of fabricating an ohmic contact for a group III nitride-based device

Method of manufacturing a semiconductor device including an LDMOS transistor

Monitor structures and methods of formation thereof

Semiconductor device and method of making the same

Method for fabricating trench capacitors for large scale integrated semiconductor memories

Contact spring configuration for contacting a semiconductor wafer and method for producing a contact spring configuration

Semiconductor device and method for fabricating a semiconductor wafer

LDMOS transistor and method

LDMOS transistor

Semiconductor wafer

LDMOS transistor and method

Method of fabricating a semiconductor wafer that includes producing a planarised surface having both a mesa surface and an insulating layer surface

BIRNER ALBERT

Through substrate via semiconductor components

Monitor structures and methods of formation thereof

Semiconductor device and method of making the same

SEIDEL UWE

Method for producing a copper connection between two sides of a substrate

INFINEON TECHNOLOGIES AUSTRIA AG

Method of manufacturing semiconductor devices by bonding a semiconductor disk on a base substrate, composite wafer and semiconductor device