Inventor
LEIB JUERGEN
DE25 patents
⚠️ This page may combine multiple inventors who share the name “LEIB JUERGEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SCHOTT AG
13 patentsUS7285834B2Oct 23, 2007
Process for producing microelectromechanical components and a housed microelectromechanical component
SCHOTT AG39 citations95
US7700957B2Apr 20, 2010
Process for making contact with and housing integrated circuits
SCHOTT AG11 citations92
US7476623B2Jan 13, 2009
Method for microstructuring flat glass substrates
SCHOTT AG20 citations92
US7396741B2Jul 8, 2008
Method for connecting substrate and composite element
SCHOTT AG21 citations92
US7160478B2Jan 9, 2007
Method for producing electronic componets
SCHOTT AG43 citations92
US7071521B2Jul 4, 2006
Process for producing microelectromechanical components and a housed microelectromechanical component
SCHOTT AG36 citations92
US7786002B2Aug 31, 2010
Method for producing a component comprising a conductor structure that is suitable for use at high frequencies
SCHOTT AG12 citations83
US7495348B2Feb 24, 2009
Process for producing copy protection for an electronic circuit
SCHOTT AG14 citations83
US7326446B2Feb 5, 2008
Method for coating metal surfaces and substrate having a coated metal surface
SCHOTT AG7 citations73
US7700397B2Apr 20, 2010
Process for packaging components, and packaged components
SCHOTT AG2 citations63
US7821106B2Oct 26, 2010
Process for making contact with and housing integrated circuits
SCHOTT AG2 citations62
US7863200B2Jan 4, 2011
Process of vapor depositing glass layers for wafer-level hermetic encapsulation of electronic modules
SCHOTT AG1 citations51
US7566672B2Jul 28, 2009
Glass composition exclusively consisting of oxides which already at low temperatures form volatile fluorides by reaction with fluorine and its use
SCHOTT AG0 citations40
LEIB JUERGEN
7 patentsUS10898136B2Jan 26, 2021
Monitoring device for animals
LEIB JUERGEN4 citations70
US8420445B2Apr 16, 2013
Method for packing semiconductor components and product produced according to the method
LEIB JUERGEN4 citations62
US8399293B2Mar 19, 2013
Method for packaging electronic devices and integrated circuits
LEIB JUERGEN2 citations62
US8324024B2Dec 4, 2012
Method for production of packaged electronic components, and a packaged electronic component
LEIB JUERGEN2 citations61
US8273671B2Sep 25, 2012
Glass material for radio-frequency applications
LEIB JUERGEN3 citations61
US8309384B2Nov 13, 2012
Process for packaging components, and packaged components
LEIB JUERGEN1 citations51
US8114304B2Feb 14, 2012
Method for producing electronic components
LEIB JUERGEN1 citations51
WAFER LEVEL PACKAGING PORTFOLIO LLC
3 patentsUS8017435B2Sep 13, 2011
Method for packaging electronic devices and integrated circuits
WAFER LEVEL PACKAGING PORTFOLIO LLC8 citations83
US7880179B2Feb 1, 2011
Process for making contact with and housing integrated circuits
WAFER LEVEL PACKAGING PORTFOLIO LLC4 citations68
US8349707B2Jan 8, 2013
Process for making contact with and housing integrated circuits
WAFER LEVEL PACKAGING PORTFOLIO LLC3 citations57