Inventor
YAMAUCHI SHOICHI
JP35 patents
⚠️ This page may combine multiple inventors who share the name “YAMAUCHI SHOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
22 patentsUS6191007B1Feb 20, 2001
Method for manufacturing a semiconductor substrate
DENSO CORP759 citations99
US6251754B1Jun 26, 2001
Semiconductor substrate manufacturing method
DENSO CORP326 citations98
US6495294B1Dec 17, 2002
Method for manufacturing semiconductor substrate having an epitaxial film in the trench
DENSO CORP117 citations97
US6534380B1Mar 18, 2003
Semiconductor substrate and method of manufacturing the same
DENSO CORP471 citations96
US6495883B2Dec 17, 2002
Trench gate type semiconductor device and method of manufacturing
DENSO CORP62 citations96
US6836001B2Dec 28, 2004
Semiconductor device having epitaxially-filled trench and method for manufacturing semiconductor device having epitaxially-filled trench
DENSO CORP30 citations92
US6406982B2Jun 18, 2002
Method of improving epitaxially-filled trench by smoothing trench prior to filling
DENSO CORP27 citations92
US7170119B2Jan 30, 2007
Vertical type semiconductor device
DENSO CORP43 citations91
US7465990B2Dec 16, 2008
Semiconductor device having super junction structure
DENSO CORP9 citations84
US7417284B2Aug 26, 2008
Semiconductor device and method of manufacturing the same
DENSO CORP9 citations84
US7342265B2Mar 11, 2008
Vertical-type semiconductor device having repetitive-pattern layer
DENSO CORP11 citations84
US7037789B2May 2, 2006
Stabilization of dopant concentration in semiconductor device having epitaxially-filled trench
DENSO CORP11 citations84
US7811907B2Oct 12, 2010
Method for manufacturing semiconductor device and epitaxial growth equipment
DENSO CORP14 citations83
US7642178B2Jan 5, 2010
Semiconductor device, method for manufacturing the same and method for evaluating the same
DENSO CORP13 citations83
US7601603B2Oct 13, 2009
Method for manufacturing semiconductor device
DENSO CORP10 citations83
US7553731B2Jun 30, 2009
Method of manufacturing semiconductor device
DENSO CORP6 citations73
US7633123B2Dec 15, 2009
Semiconductor device having super junction structure
DENSO CORP4 citations63
US7342422B2Mar 11, 2008
Semiconductor device having super junction structure and method for manufacturing the same
DENSO CORP3 citations63
US6642577B2Nov 4, 2003
Semiconductor device including power MOSFET and peripheral device and method for manufacturing the same
DENSO CORP5 citations63
US7063751B2Jun 20, 2006
Semiconductor substrate formed by epitaxially filling a trench in a semiconductor substrate with a semiconductor material after smoothing the surface and rounding the corners
DENSO CORP5 citations62
US7026248B2Apr 11, 2006
Method for manufacturing semiconductor device with semiconductor region inserted into trench
DENSO CORP3 citations62
US7517771B2Apr 14, 2009
Method for manufacturing semiconductor device having trench
DENSO CORP1 citations52
TOSOH CORP
6 patentsUS10550040B2Feb 4, 2020
Red zirconia sintered body and method for manufacturing the same
TOSOH CORP2 citations73
US12319621B2Jun 3, 2025
Zirconia sintered body and method for producing same
TOSOH CORP0 citations62
US11535565B2Dec 27, 2022
Black sintered body and method for producing the same
TOSOH CORP0 citations62
US10696022B2Jun 30, 2020
Composite plate and production method therefor
TOSOH CORP0 citations50
US10682831B2Jun 16, 2020
Composite plate and method for producing same
TOSOH CORP0 citations50
US9919971B2Mar 20, 2018
Zirconia sintered body and use thereof
TOSOH CORP1 citations48
SUMCO CORP
4 patentsUS7364980B2Apr 29, 2008
Manufacturing method of semiconductor substrate
SUMCO CORP3 citations62
US9034721B2May 19, 2015
Method for manufacturing semiconductor substrate
SUMCO CORP0 citations51
US8956947B2Feb 17, 2015
Method for manufacturing semiconductor substrate
SUMCO CORP0 citations51
US7776710B2Aug 17, 2010
Manufacturing method of semiconductor wafer having a trench structure and epitaxial layer
SUMCO CORP0 citations47