Inventor

BUCKALEW BRYAN L

US65 patents

⚠️ This page may combine multiple inventors who share the name “BUCKALEW BRYAN L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BUCKALEW BRYAN L

NOVELLUS SYSTEMS INC

Cross flow manifold for electroplating apparatus

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

Apparatus for advanced packaging applications

Sonic irradiation during wafer immersion

Electroplating using DC current interruption and variable rotation rate

Cross flow manifold for electroplating apparatus

Electroplating apparatus for tailored uniformity profile

Apparatus for advanced packaging applications

Electroplating apparatus for tailored uniformity profile

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

Detection of plating on wafer holding apparatus

Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath

Control of electrolyte hydrodynamics for efficient mass transfer during electroplating

Methods and apparatus for wetting pretreatment for through resist metal plating

Methods and apparatus for wetting pretreatment for through resist metal plating

Electroplating apparatus for tailored uniformity profile

Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

Methods and apparatuses for cleaning electroplating substrate holders

Methods and apparatus for wetting pretreatment for through resist metal plating

Methods and apparatus for wetting pretreatment for through resist metal plating

Methods and apparatus for wetting pretreatment for through resist metal plating

Electroplating apparatus for tailored uniformity profile

LAM RES CORP

Dynamic modulation of cross flow manifold during elecroplating

Edge flow element for electroplating apparatus

Pretreatment method for photoresist wafer processing

Apparatus and method for dynamic control of plated uniformity with the use of remote electric current

Dynamic modulation of cross flow manifold during electroplating

Methods and apparatuses for dynamically tunable wafer-edge electroplating

Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes

Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating

Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity

Pretreatment method for photoresist wafer processing

Cross flow conduit for foaming prevention in high convection plating cells

Methods and apparatus for flow isolation and focusing during electroplating

Copper electrodeposition on cobalt lined features

Systems and methods for fabrication of a redistribution layer to avoid etching of the layer

Apparatuses and methods for maintaining pH in nickel electroplating baths

Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes

Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity

Copper electrodeposition sequence for the filling of cobalt lined features

Copper electrodeposition on cobalt lined features

Dynamic modulation of cross flow manifold during elecroplating

ANTONELLI GEORGE ANDREW

Remote plasma processing of interface surfaces

Remote plasma processing of interface surfaces

MAYER STEVEN T

Electroplating apparatus for tailored uniformity profile

RANJAN MANISH

Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath

PONNUSWAMY THOMAS A

Pulse sequence for plating on thin seed layers

PRABHAKAR VINAY

Wafer electroplating apparatus for reducing edge defects

Hawkins jeffrey alan

Deionized water conditioning system and methods