Inventor
YANG XIAO CHARLES
US48 patents
⚠️ This page may combine multiple inventors who share the name “YANG XIAO CHARLES”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YANG XIAO CHARLES
22 patentsUS8421082B1Apr 16, 2013
Integrated CMOS and MEMS with air dielectric method and system
YANG XIAO CHARLES51 citations98
US8227285B1Jul 24, 2012
Method and structure of monolithetically integrated inertial sensor using IC foundry-compatible processes
YANG XIAO CHARLES46 citations98
US8637943B1Jan 28, 2014
Multi-axis integrated MEMS devices with CMOS circuits and method therefor
YANG XIAO CHARLES38 citations94
US8395252B1Mar 12, 2013
Integrated MEMS and CMOS package and method
YANG XIAO CHARLES47 citations94
US8704238B2Apr 22, 2014
Method and structure of monolithically integrated IC-MEMS oscillator using IC foundry-compatible processes
YANG XIAO CHARLES24 citations93
US8652961B1Feb 18, 2014
Methods and structure for adapting MEMS structures to form electrical interconnections for integrated circuits
YANG XIAO CHARLES20 citations93
US8506529B1Aug 13, 2013
Method and structure of monolithetically integrated microneedle biochip
YANG XIAO CHARLES29 citations93
US8476084B1Jul 2, 2013
Method and structure of sensors or electronic devices using vertical mounting
YANG XIAO CHARLES26 citations93
US8432005B2Apr 30, 2013
Method and structure of monolithetically integrated inertial sensor using IC foundry-compatible processes
YANG XIAO CHARLES17 citations93
US8324047B1Dec 4, 2012
Method and structure of an integrated CMOS and MEMS device using air dielectric
YANG XIAO CHARLES33 citations93
US8227911B1Jul 24, 2012
Method and structure of wafer level encapsulation of integrated circuits with cavity
YANG XIAO CHARLES18 citations93
US8071398B1Dec 6, 2011
Method and structure of monolithically integrated IC-MEMS oscillator using IC foundry-compatible processes
YANG XIAO CHARLES23 citations93
US8936959B1Jan 20, 2015
Integrated rf MEMS, control systems and methods
YANG XIAO CHARLES14 citations84
US8796790B2Aug 5, 2014
Method and structure of monolithetically integrated micromachined microphone using IC foundry-compatiable processes
YANG XIAO CHARLES10 citations84
US8796746B2Aug 5, 2014
Method and structure of monolithically integrated pressure sensor using IC foundry-compatible processes
YANG XIAO CHARLES6 citations73
US8643612B2Feb 4, 2014
Touchscreen operation threshold methods and apparatus
YANG XIAO CHARLES5 citations73
US8584521B1Nov 19, 2013
Accurate gyroscope device using MEMS and quartz
YANG XIAO CHARLES4 citations63
US8569180B2Oct 29, 2013
Method and structure of wafer level encapsulation of integrated circuits with cavity
YANG XIAO CHARLES4 citations63
US8148781B2Apr 3, 2012
Method and structures of monolithically integrated ESD suppression device
YANG XIAO CHARLES3 citations63
US8999835B2Apr 7, 2015
Method and structure of monolithically integrated ESD supperssion device
YANG XIAO CHARLES0 citations52
US8120076B2Feb 21, 2012
Method and structure of monolithically integrated infrared sensing device
YANG XIAO CHARLES1 citations52
US7473912B2Jan 6, 2009
Method and apparatus for patterning micro and nano structures using a mask-less process
YANG XIAO CHARLES0 citations42
MCUBE INC
10 patentsUS8367522B1Feb 5, 2013
Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads
MCUBE INC24 citations93
US9595479B2Mar 14, 2017
Method and structure of three dimensional CMOS transistors with hybrid crystal orientations
MCUBE INC10 citations84
US9150406B2Oct 6, 2015
Multi-axis integrated MEMS devices with CMOS circuits and method therefor
MCUBE INC6 citations84
US8742520B2Jun 3, 2014
Three axis magnetic sensor device and method
MCUBE INC12 citations84
US7928632B2Apr 19, 2011
Method and structure for an out-of-plane compliant micro actuator
MCUBE INC12 citations84
US9276080B2Mar 1, 2016
Methods and structures of integrated MEMS-CMOS devices
MCUBE INC6 citations79
US9440846B2Sep 13, 2016
System on a chip using integrated MEMS and CMOS devices
MCUBE INC2 citations63
US8592993B2Nov 26, 2013
Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads
MCUBE INC4 citations63
US9365412B2Jun 14, 2016
Integrated CMOS and MEMS devices with air dieletrics
MCUBE INC0 citations52
US9950924B2Apr 24, 2018
Methods and structures of integrated MEMS-CMOS devices
MCUBE INC0 citations47
MIRADIA INC
6 patentsUS7034984B2Apr 25, 2006
Fabrication of a high fill ratio reflective spatial light modulator with hidden hinge
MIRADIA INC68 citations98
US7064045B2Jun 20, 2006
Laser based method and device for forming spacer structures for packaging optical reflection devices
MIRADIA INC16 citations84
US7344956B2Mar 18, 2008
Method and device for wafer scale packaging of optical devices using a scribe and break process
MIRADIA INC6 citations74
US7109066B2Sep 19, 2006
Method and device for forming spacer structures for packaging optical reflection devices
MIRADIA INC10 citations74
US7449284B2Nov 11, 2008
Method and structure for fabricating mechanical mirror structures using backside alignment techniques
MIRADIA INC2 citations63
US7160791B2Jan 9, 2007
Batch process and device for forming spacer structures for packaging optical reflection devices
MIRADIA INC6 citations63
YANG XIAO “CHARLES”
6 patentsUS8928696B1Jan 6, 2015
Methods and apparatus for operating hysteresis on a hand held device
YANG XIAO “CHARLES”26 citations93
US8794065B1Aug 5, 2014
Integrated inertial sensing apparatus using MEMS and quartz configured on crystallographic planes
YANG XIAO “CHARLES”20 citations93
US9709509B1Jul 18, 2017
System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process
YANG XIAO “CHARLES”20 citations84
US8823007B2Sep 2, 2014
Integrated system on chip using multiple MEMS and CMOS devices
YANG XIAO “CHARLES”16 citations84
US8797279B2Aug 5, 2014
Analog touchscreen methods and apparatus
YANG XIAO “CHARLES”4 citations73
US9006878B2Apr 14, 2015
Method and device for wafer scale packaging of optical devices using a scribe and break process
YANG XIAO “CHARLES”0 citations52