Inventor
LIN HOU-TE
TW42 patents
⚠️ This page may combine multiple inventors who share the name “LIN HOU-TE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED OPTOELECTRONIC TECH
29 patentsUS9431591B1Aug 30, 2016
LED package with reflecting cup
ADVANCED OPTOELECTRONIC TECH8 citations84
USD763206SAug 9, 2016
Light emitting diode package
ADVANCED OPTOELECTRONIC TECH9 citations84
US9543486B1Jan 10, 2017
LED package with reflecting cup
ADVANCED OPTOELECTRONIC TECH6 citations73
USD763207SAug 9, 2016
Light emitting diode package
ADVANCED OPTOELECTRONIC TECH3 citations73
US9147809B1Sep 29, 2015
Flip chip light emitting diode packaging structure
ADVANCED OPTOELECTRONIC TECH2 citations63
US9048394B2Jun 2, 2015
Light emitting diode package with oxidation-resistant metal coating layer
ADVANCED OPTOELECTRONIC TECH3 citations63
US10890802B2Jan 12, 2021
Optical lens, backlight module and display device using same
ADVANCED OPTOELECTRONIC TECH0 citations62
US9842968B2Dec 12, 2017
LED package
ADVANCED OPTOELECTRONIC TECH0 citations52
US9666568B2May 30, 2017
Photoelectric device and method of manufacturing the same
ADVANCED OPTOELECTRONIC TECH0 citations52
US9660144B2May 23, 2017
LED package and LED die
ADVANCED OPTOELECTRONIC TECH0 citations52
US9640742B2May 2, 2017
LED package with reflecting cup
ADVANCED OPTOELECTRONIC TECH0 citations52
US9437585B2Sep 6, 2016
Photoelectric device and method of manufacturing the same
ADVANCED OPTOELECTRONIC TECH0 citations52
US9324702B2Apr 26, 2016
Photoelectric device
ADVANCED OPTOELECTRONIC TECH1 citations52
US9065028B2Jun 23, 2015
Flip-chip light emitting diode package with moisture barrier layer
ADVANCED OPTOELECTRONIC TECH1 citations52
US9040325B2May 26, 2015
Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers
ADVANCED OPTOELECTRONIC TECH0 citations52
US8985826B2Mar 24, 2015
Backlight module having optcial fiber
ADVANCED OPTOELECTRONIC TECH0 citations52
US8779442B2Jul 15, 2014
LED module
ADVANCED OPTOELECTRONIC TECH0 citations52
US8900895B2Dec 2, 2014
Method for manufacturing LED package
ADVANCED OPTOELECTRONIC TECH1 citations51
US9543283B2Jan 10, 2017
Light emitting diode package and method for manufacturing same
ADVANCED OPTOELECTRONIC TECH0 citations48
US9786642B1Oct 10, 2017
Light emitting diode package substrate and light emitting diode package element
ADVANCED OPTOELECTRONIC TECH0 citations42
US9543482B2Jan 10, 2017
LED package
ADVANCED OPTOELECTRONIC TECH0 citations42
US9406842B2Aug 2, 2016
Flip chip light emitting diode packaging structure
ADVANCED OPTOELECTRONIC TECH0 citations42
US9048408B2Jun 2, 2015
Light emitting diode package
ADVANCED OPTOELECTRONIC TECH0 citations42
US9018668B2Apr 28, 2015
Light emitting diode package
ADVANCED OPTOELECTRONIC TECH0 citations42
US8981447B2Mar 17, 2015
Light emitting diode package
ADVANCED OPTOELECTRONIC TECH0 citations42
US8822277B2Sep 2, 2014
Method for manufacturing light emitting diode package
ADVANCED OPTOELECTRONIC TECH0 citations42
US8981387B2Mar 17, 2015
Light emitting diode assembly having a deformable lens
ADVANCED OPTOELECTRONIC TECH0 citations41
US8765499B2Jul 1, 2014
Method for manufacturing LED package
ADVANCED OPTOELECTRONIC TECH0 citations41
US10510931B2Dec 17, 2019
Side-view light emitting diode package structure
ADVANCED OPTOELECTRONIC TECH0 citations35
CHANG CHAO-HSIUNG
5 patentsUS8546833B2Oct 1, 2013
LED package and light emitting device having the same
CHANG CHAO-HSIUNG2 citations62
US8545061B2Oct 1, 2013
Light emitting diode device with lens having a cavity
CHANG CHAO-HSIUNG2 citations62
US8536592B2Sep 17, 2013
LED package device
CHANG CHAO-HSIUNG2 citations62
US8840262B2Sep 23, 2014
LED and backlight module using the same
CHANG CHAO-HSIUNG1 citations51
US8569789B2Oct 29, 2013
Light emitting diode package with reflective layer
CHANG CHAO-HSIUNG0 citations41
LIN HOU-TE
4 patentsUSD666353SAug 28, 2012
LED lens
LIN HOU-TE38 citations91
US8729572B2May 20, 2014
Light emitting diode package having a voltage stabilizing module consisting of two doping layers
LIN HOU-TE0 citations50
US8552462B2Oct 8, 2013
LED package and method for manufacturing the same
LIN HOU-TE0 citations50
US8492778B2Jul 23, 2013
Light emitting diode device
LIN HOU-TE0 citations40