Inventor

CHEN PIN-CHUAN

TW66 patents

⚠️ This page may combine multiple inventors who share the name “CHEN PIN-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN PIN-CHUAN

ADVANCED OPTOELECTRONIC TECH

LED package with reflecting cup

Light emitting diode package

LED package with reflecting cup

Light emitting diode package

Flip chip light emitting diode packaging structure

Light emitting diode package with oxidation-resistant metal coating layer

Optical lens, backlight module and display device using same

LED with thin package struture and method for manufacturing the same

Light emitting diode package

Package structure of integrated circuit device and manufacturing method thereof

Lead frame and light emitting diode package having the same

Backlight module with light-guiding portions

LED package

Photoelectric device and method of manufacturing the same

LED package and LED die

LED package with reflecting cup

Photoelectric device and method of manufacturing the same

Photoelectric device

Flip-chip light emitting diode package with moisture barrier layer

Led

LED lamp having a large illumination angle

Method for manufacturing LED

Method for manufacturing LED package

Light emitting diode package and method for manufacturing the same

Light emitting diode package and method for manufacturing the same

Package structure of compound semiconductor device and fabricating method thereof

Lead frame and light emitting diode package having the same

Lead frame and light emitting diode package having the same

Light emitting diode package and method for manufacturing same

Light emitting diode package substrate and light emitting diode package element

LED package

Optical lens and backlight module incorporating the same

CHEN PIN-CHUAN

Method for packaging light emitting diodes

Method for manufacturing light emitting diode package

Method for manufacturing light emitting diode

LED and method for manufacturing the same

LIN HSIN-CHIANG

Light emitting diode package and method of manufacturing the same

LED with versatile mounting ways

LED package and method for making the same

LED and method for manufacturing the same

CHEN LUNG-HSIN

Method for packaging light emitting diode

Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the same

Method for manufacturing phosphor film and method for making LED package having the phosphor film

ZHONGSHAN INNOCLOUD IP SERVICES CO LTD

Light-emitting diode manufacturing method

Method for manufacturing light emitting diode packages

KUO CHESTER

Side-emitting LED package and manufacturing method of the same

CHEN LI-HSIANG

Method for packaging light emitting diode

CHEN PIN CHUAN

Package structure of compound semiconductor device and fabricating method thereof

CHUNGHWA TELECOM CO LTD

Automated integration of events for a surveillance system

HONG MENG-HSIEN

Method for making light emitting diode package