Inventor · disambiguated record
Kim Hong Chen
Also filed as: CHEN KIM · CHEN KIM H · CHEN KIM HONG
40 granted patents·2 pending applications·963 citations·filing 1991–2024
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD23TAIWAN SEMICONDUCTOR MFG8HEWLETT PACKARD CO4AGILENT TECHNOLOGIES INC2HOU SHANG-YUN1
Top patents by PatentIndex Score
42 records- 0198US10332823B2Packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 25, 2019·19 cites·20 claims
- 0298US9780072B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 3, 2017·25 cites·20 claims
- 0398US8519537B23D semiconductor package interposer with die cavityJENG SHIN-PUU·Filed 2010·Granted Aug 27, 2013·81 cites·19 claims
- 0497US10461009B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·15 cites·20 claims
- 0597US10157818B2Methods of cooling packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 18, 2018·19 cites·20 claims
- 0697US10062665B2Semiconductor packages with thermal management features for reduced thermal crosstalkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·17 cites·20 claims
- 0797US9595506B2Packages with thermal management features for reduced thermal crosstalk and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 14, 2017·18 cites·20 claims
- 0897US9269694B2Packages with thermal management features for reduced thermal crosstalk and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 23, 2016·26 cites·20 claims
- 0997US9224673B2Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 29, 2015·26 cites·12 claims
- 1097US9082743B23DIC packages with heat dissipation structuresTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 14, 2015·24 cites·20 claims
- 1197US9076754B23DIC packages with heat sinks attached to heat dissipating ringsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 7, 2015·34 cites·20 claims
- 1296US9735082B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 15, 2017·16 cites·19 claims
- 1396US9583415B2Packages with thermal interface material on the sidewalls of stacked diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 28, 2017·30 cites·19 claims
- 1496US9385095B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·19 cites·20 claims
- 1594US8865521B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 21, 2014·16 cites·20 claims
- 1693US10446520B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 15, 2019·7 cites·20 claims
- 1792US10157813B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·5 cites·20 claims
- 1892US9941251B23DIC packages with heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 10, 2018·6 cites·20 claims
- 1992US9502383B23D integrated circuit package processing with panel type lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 22, 2016·10 cites·17 claims
- 2090US9184128B23DIC package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 10, 2015·7 cites·20 claims
- 2189US5585671AReliable low thermal resistance package for high power flip clip ICsFiled 1994·Granted Dec 17, 1996·116 cites·9 claims
- 2288US9576938B23DIC packages with heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 21, 2017·4 cites·20 claims
- 2387US5199165AHeat pipe-electrical interconnect integration method for chip modulesHEWLETT PACKARD CO·Filed 1992·Granted Apr 6, 1993·98 cites·5 claims
- 2486US2024222218A13dic packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2585US9978660B2Package with embedded heat dissipation featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 22, 2018·5 cites·20 claims
- 2685US6191478B1Demountable heat spreader and high reliability flip chip package assemblyAGILENT TECHNOLOGIES INC·Filed 1999·Granted Feb 20, 2001·77 cites·20 claims
- 2782US10629510B2Package with embedded heat dissipation featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·2 cites·20 claims
- 2882US5155661AAluminum nitride multi-chip moduleHEWLETT PACKARD CO·Filed 1991·Granted Oct 13, 1992·73 cites·5 claims
- 2981US5426405AFamily of different-sized demountable hybrid assemblies with microwave-bandwidth interconnectsHEWLETT PACKARD CO·Filed 1994·Granted Jun 20, 1995·73 cites·16 claims
- 3080US9379036B23DIC packages with heat dissipation structuresTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 28, 2016·3 cites·20 claims
- 3179US8993432B2Test structure and method of testing electrical characteristics of through viasHOU SHANG-YUN·Filed 2011·Granted Mar 31, 2015·6 cites·20 claims
- 3277US11961779B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 3374US5161090AHeat pipe-electrical interconnect integration for chip modulesHEWLETT PACKARD CO·Filed 1991·Granted Nov 3, 1992·53 cites·18 claims
- 3471US9859266B2Method of forming 3D integrated circuit package with panel type lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·1 cites·20 claims
- 3570US9496249B23DIC package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 15, 2016·1 cites·20 claims
- 3669US11133237B2Package with embedded heat dissipation featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
- 3765US11037852B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 3863US6698646B2Room temperature gold wire bondingAGILENT TECHNOLOGIES INC·Filed 2002·Granted Mar 2, 2004·16 cites·11 claims
- 3960US6817884B1Multi-I/O-port-41-channel connectorFiled 2003·Granted Nov 16, 2004·15 cites·3 claims
- 4058US9985001B23DIC package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·0 cites·19 claims
- 4148US9462692B2Test structure and method of testing electrical characteristics of through viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·0 cites·20 claims
- 4225US2003006267A1Room temperature gold wire bondingFiled 2001·Application pending·0 cites
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