Inventor · disambiguated record
Hannes Eder
Also filed as: EDER HANNES
7 granted patents·1 pending application·162 citations·filing 2006–2015
80Inventor score
Files withINFINEON TECHNOLOGIES AG4EDER HANNES1HESS REINHARD1INFINEON TECHNOLOGIES AUSTRIA AG1OTREMBA RALF1
Top patents by PatentIndex Score
8 records- 0197US9627287B2Thinning in package using separation structure as stopINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 18, 2017·153 cites·13 claims
- 0276US8951915B2Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangementsHESS REINHARD·Filed 2012·Granted Feb 10, 2015·6 cites·14 claims
- 0371US9275916B2Removable indicator structure in electronic chips of a common substrate for process adjustmentINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·2 cites·14 claims
- 0457US8324115B2Semiconductor chip, semiconductor device and methods for producing the sameOTREMBA RALF·Filed 2006·Granted Dec 4, 2012·1 cites·27 claims
- 0548US10020285B2Method of producing a semiconductor device and a semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Jul 10, 2018·0 cites·20 claims
- 0646US9576875B2Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 21, 2017·0 cites·11 claims
- 0740US8637379B2Device including a semiconductor chip and a carrier and fabrication methodEDER HANNES·Filed 2009·Granted Jan 28, 2014·0 cites·20 claims
- 0832US2016240366A1Processing of Semiconductor DevicesINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →