Inventor
HO CHI CHING
TW19 patents
Patents
19 patentsUS11315881B1Apr 26, 2022
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations83
US12525505B2Jan 13, 2026
Electronic package of two vertically stacked chips with chip-to-chip bump connections and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12438094B2Oct 7, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12412820B2Sep 9, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12412819B2Sep 9, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12334452B2Jun 17, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12051641B2Jul 30, 2024
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US8810045B2Aug 19, 2014
Packaging substrate and semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations59
US12199047B2Jan 14, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations58
US12176291B2Dec 24, 2024
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations56
US12125828B2Oct 22, 2024
Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations55
US11923337B2Mar 5, 2024
Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations55
US12476229B2Nov 18, 2025
Electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9265154B2Feb 16, 2016
Packaging substrate and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9991197B2Jun 5, 2018
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations48
US9165789B2Oct 20, 2015
Fabrication method of packaging substrate
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48
US9006039B2Apr 14, 2015
Fabrication method of packaging substrate, and fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48
US12575420B2Mar 10, 2026
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations46
US9899235B2Feb 20, 2018
Fabrication method of packaging substrate
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40